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Step 8.
If a TCM module is installed, gently remove it from the defective system-board assembly and
immediately install it on the replacement system-board assembly. (see "Trusted Cryptographic
Module (TCM) replacement" on page 92).
Attention:
• TPM/TCM policy settings may need to be made when the TCM module is re-installed on the
replacement system-board assembly. For details, see "Set the TPM/TCM policy" on page 90.
Step 9.
Transfer processor and heat sink assembly 1 (rear processor) from the defective system-board
assembly to the replacement system-board assembly (see "Remove a processor and heat sink" on
page 66 and "Install a processor and heat sink" on page 70).
Attention:
• Remove and install only one processor at a time.
• When removing or installing a processor, protect the other processor socket with a processor
heat sink filler.
• When transferring a processor to a replacement system-board assembly, install the processor
heat sink filler in the defective system-board assembly immediately after installing the processor
in the replacement system-board assembly.
Step 10. Repeat Step 9 for the processor and heat sink assembly 2 (front processor), if one is installed.
Step 11. Remove the DIMMs one at a time from the defective system-board assembly (see "Remove a
DIMM" on page 44 and immediately install them in the replacement system-board assembly (see
"Install a DIMM" on page 47).
Attention:
• Remove and install only one DIMM at a time.
Step 12. Remove all of the installed components in the following list from the defective system-board
assembly; then, immediately install them on the replacement system-board assembly:
• I/O expansion adapters and other optional components. See procedures such as:
– "Remove an I/O expansion adapter" on page 57 and "Install an I/O expansion adapter" on
page 58
Step 13. If a RAID adapter was removed from the defective system-board assembly, install it in the
replacement system-board assembly (see "Install a RAID adapter" on page 79 ).
Step 14. Install the air baffle in the replacement system-board assembly (see "Install the air baffle" on page
32). The air baffle is required to maintain system cooling.
Note: Retaining clips on the DIMM connectors must be in the closed position to install the air
baffle.
Step 15. Install the cover that you removed from the original (defective) system-board assembly onto the
replacement system-board assembly (see "Install the compute node cover" on page 43).
Step 16. Make sure that both processor sockets on defective system-board assembly have heat sink fillers
installed; then, install the cover that came with the replacement system-board assembly onto the
defective system-board assembly (see "Install the compute node cover" on page 43).
Note: Retention clips that secure the I/O expansion adapters must be in the closed position to
install the cover.
Step 17. If a blank ID label plate is on the replacement system-board assembly, remove it and discard (see
"Remove the ID label plate" on page 55).
Step 18. Remove the ID label plate that has machine type and serial number information from the front panel
of the defective system-board assembly and immediately install it on the replacement system-
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ThinkSystem SN550 Compute Node Maintenance Manual
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