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2.7.1
Schematic design-in checklist for u-blox 5 ................................................................................... 27
2.7.2
AMY-5M design .......................................................................................................................... 28
2.7.3
Design for AMY-5M .................................................................................................................... 29
2.8
Layout design-in checklist ................................................................................................................... 31
2.9
Layout ................................................................................................................................................ 32
2.9.1
Footprint ..................................................................................................................................... 32
2.9.2
Paste mask .................................................................................................................................. 32
2.9.3
Placement ................................................................................................................................... 33
2.10
Migration considerations ................................................................................................................. 33
2.11
EOS/ESD/EMI precautions ................................................................................................................ 34
2.11.1
Abbreviations .............................................................................................................................. 34
2.11.2
Electrostatic Discharge (ESD) ........................................................................................................ 34
2.11.3
ESD protection measures ............................................................................................................. 34
2.11.4
Electrical Overstress (EOS) ............................................................................................................ 35
2.11.5
EOS protection measures ............................................................................................................. 35
2.11.6
Electromagnetic Interference (EMI) .............................................................................................. 35
2.11.7
GSM applications ........................................................................................................................ 36
2.11.8
Recommended parts ................................................................................................................... 38
3
Product handling & soldering .................................................................................... 39
3.1
Packaging, shipping, storage and moisture preconditioning ............................................................... 39
3.2
ESD handling precautions ................................................................................................................... 39
3.3
Soldering ............................................................................................................................................ 40
3.3.1
Soldering paste............................................................................................................................ 40
3.3.2
Reflow soldering ......................................................................................................................... 40
3.3.3
Optical inspection ........................................................................................................................ 40
3.3.4
Repeated reflow soldering ........................................................................................................... 40
3.3.5
Wave soldering............................................................................................................................ 40
3.3.6
Hand soldering ............................................................................................................................ 40
3.3.7
Rework ........................................................................................................................................ 40
3.3.8
Conformal coating ...................................................................................................................... 40
3.3.9
Casting ........................................................................................................................................ 41
3.3.10
Use of ultrasonic processes .......................................................................................................... 41
4
Product testing ........................................................................................................... 42
4.1
Test parameters for OEM manufacturer .............................................................................................. 42
4.2
System sensitivity test ......................................................................................................................... 42
4.2.1
Guidelines for sensitivity tests ...................................................................................................... 42
GPS.G5-MS5-08207-A3
AMY-5M - Hardware Integration Manual
Preliminary
Contents
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