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Philips Semiconductors
Vertical deflection power amplifier for
monitors
PACKAGE OUTLINE
SIL9P: plastic single in-line power package; 9 leads
1
Z
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
2
max.
4.6
mm
2.0
4.2
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT131-2
1997 Jan 20
D
d
e
b
p
b
(1)
b
c
D
p
max.
0.75
0.48
24.0
1.1
0.60
0.38
23.6
IEC
JEDEC
non-concave
E h
j
b
9
w
M
0
5
10 mm
scale
(1)
d
D
E
h
20.0
12.2
10
2.54
19.6
11.8
REFERENCES
EIAJ
10
D
h
x
view B: mounting base side
A 2
B
E
A
1
L
c
Q
e
E
j
L
h
3.4
17.2
6
3.1
16.5
EUROPEAN
PROJECTION
Product specification
TDA4861
SOT131-2
(1)
Q
w
x
Z
2.00
2.1
0.25
0.03
1.8
1.45
ISSUE DATE
92-11-17
95-03-11
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