Lantronix Micro125 Integration Manual
Lantronix Micro125 Integration Manual

Lantronix Micro125 Integration Manual

Embedded device server
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Micro125
Embedded Device Server
Integration Guide
Part Number 900-587
Revision C December 2015

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Table of Contents
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Summary of Contents for Lantronix Micro125

  • Page 1 Micro125 Embedded Device Server Integration Guide Part Number 900-587 Revision C December 2015...
  • Page 2: Copyright And Trademark

    Copyright and Trademark © 2015 Lantronix, Inc. All rights reserved. No part of the contents of this publication may be transmitted or reproduced in any form or by any means without the written permission of Lantronix. Printed in the United States of America.
  • Page 3: Table Of Contents

    Serial Signals ......................15 Additional Emission Improvements ................15 4: Test Bed Board Layout ....................... 16 Test Bed Connectors ....................17 A: Compliance and Warranty Information Compliance Information ....................18 RoHS Notice ......................19 Warranty ........................19 Micro125 Embedded Device Server Integration Guide...
  • Page 4: List Of Figures

    List of Figures Figure 2-1 Micro125 Board Layout ....................... 8 Figure 2-2 Micro125 Top View ........................8 Figure 2-3 Micro125 Connector End View ....................9 Figure 2-4 Micro125 Connectors ........................9 Figure 2-5 RJ45 Ethernet Connector ......................10 Figure 2-6 Micro125 Status LEDs ....................... 11 Figure 2-7 Product Label ..........................
  • Page 5: 1: Introduction

    DB9 to DB-25 converter About the Integration Guide This guide provides the information needed to install and test the Micro125 embedded device server on the Evaluation Board. The intended audience is the engineer responsible for integrating the device server into your product.
  • Page 6: Chapter Summaries

    Chapter Summaries The remaining chapters in this guide include: Chapter Description 2: Description and Describes and provides information about the Micro125 Specifications device server. 3: Integration Guidelines Provides general guidelines to help you integrate the Micro125 board into your design.
  • Page 7: 2: Description And Specifications

    Flash ROM for easy software upgrades  Serial channel status, Ethernet link status, and diagnostic LEDs The Micro125 requires 5 VDC ±5% at ~ 210mA power and is designed to operate in an extended temperature range (see Technical Specifications on page Error! Bookmark not defined.).
  • Page 8: Layout And Dimensions

    2: Description and Specifications Layout and Dimensions The Micro125 integrates into products quickly and easily. Serial interfacing is accomplished via a TTL connector, and for Ethernet access, an optional RJ45 (10/100Base-T) connector is available. The orientation of its interface pins can be specified to fit your product.
  • Page 9: Connectors

    CON3 CON1 (TTL) CON4 (LEDs) The Micro125 that comes with the integration kit is factory configured. When ordering the Micro125 for production use, each connector can be specified as follows:  Pins on/off the board and top/bottom (Figure 2-2 Figure 2-3) ...
  • Page 10: Ethernet Interface

    A = Port (Channel) 1 B = Port (Channel) 2 Ethernet Interface The standard Micro125 ships with an RJ45 10/100Base-T Ethernet connector (CON2). At the time of ordering, you can specify whether to include this RJ45 connector. You can use CON3 as an alternative.
  • Page 11: Status Leds

    2: Description and Specifications Status LEDs The Micro125 carrier board has four status LEDs: serial port (Channel) 1 status, serial port (Channel) 2 status, diagnostics, and network link status. See the following table for a complete description of LED functions and pinout locations.
  • Page 12: Product Information Label

    MAC Address Technical Specifications Table 2-3 Micro125 Technical Specifications Category Description CPU, Memory Lantronix DSTni-EX 186 CPU, 256-Kbyte zero wait state SRAM, 512-Kbyte flash, 16-Kbyte boot ROM Firmware Upgradeable via TFTP and serial port Serial Interface 2 TTL serial interfaces (Asynchronous).
  • Page 13 EN 55024: 1998 +A1: 2001 +A2: 2003 EN 61000-4-2: 1995 + A2: 2001 EN 61000-4-3: 2006 + A1: 2008 EN 61000-4-4: 2004 EN 61000-4-5: 2006 EN 61000-4-6: 2007 EN 61000-4-8: 1994 + A1: 2001 EN 61000-4-11: 2004 EN 61000-6-2: 2001 Micro125 Embedded Device Server Integration Guide...
  • Page 14: 3: Integration Guidelines

    Power Supply The Micro125 runs at 5 VDC nominal, ±5%. The current consumption varies for the different products and depends upon their operating conditions. Refer to the current requirements listed in the product specification to design an appropriate power supply.
  • Page 15: Virtual Ground

    Common mode chokes help pass the conducted emission requirements of the EN55022 for frequencies below 30 MHz. Metal cases or partial metal shielding inside the unit can also help to reduce emission levels so that even more stringent standards can be passed. Micro125 Embedded Device Server Integration Guide...
  • Page 16: 4: Test Bed

    4: Test Bed The Micro125 Embedded Integration Kit includes a test bed (carrier board) that provides serial connections to the device server. The Micro125 device server provides a network 10/100Base-T RJ45. The test bed contains a power LED, TTL to RS-232 and RS-232 to TTL conversion hardware, a 3-pin connector for the second serial port, and mounting hardware for the Micro125.
  • Page 17: Test Bed Connectors

    Figure 4-2 Pin Configurations Test Bed Connectors The Micro125 test bed has four connectors: CON1 (Serial Port 1 or Channel 1), CON2 (TTL Interface), CON4 (Serial Port 2 or Channel 2), and CON3, which is a 5VDC power supply connector.
  • Page 18: A: Compliance And Warranty Information Compliance Information

    Compliance Information (According to ISO/IEC Guide 22 and EN 45014) Manufacturer’s Name & Address Lantronix 167 Technology Drive, Irvine, CA 92618 USA Declares that the following product: Product Name Model: Micro125 Embedded Device Server Conforms to the following standards or other normative documents:...
  • Page 19: Rohs Notice

    A: Compliance and Warranty Information RoHS Notice All Lantronix products in the following families are China RoHS-compliant and free of the following hazardous substances and elements: • • • Lead (Pb) Mercury (Hg) Polybrominated biphenyls (PBB) • • • Cadmium (Cd)

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