Power Block - LG -P970 Service Manual

3.10 Power Block

3.10.1 General
Since P970 uses two individual chips, XMM6160 (IFX Modem) uses integrated PMIC and OMAP3630 uses
TWL5034 as a main PMIC.
3.10.2 XMM6160 (IFX Modem)
X-GOLD™616 is a single integrated circuit UMTS/GPRS/EDGE Baseband Controller with integrated mixed signal
audio and measurement subsystem and modem power management unit. This system on chip designed in
Power Block Diagram (CP)
Infineon's low power 65nm CMOS process technology provides the performance to meet the ever increasing
demands of the cellular subscriber market for feature rich terminals at lowest power consumption and a very
competitive cost position.
PMB9801 PMB9801
LGE Internal Use Only
vSD1 vSD1 1.3v_Core(450mA)
(450mA)
1.8v_SD(450mA)
vSD2
vSD2
(4450mA
1.35v_PLL(30mA)
vDD_vPLL )
2.5v_ANA2(70mA)
vANA2
1.2v_MiPi(60mA)
vMiPi
2.3v_rtC(7mA)
vDD_vrtC
3.1v_USB(40mA)
vDD_vUSB
2.85v_rF1(180mA)
vrF1
2.85v_rF2(60mA)
vrF2
vDD_vPMU
vANA1
2.85v_SiM 2 85v SiM
vDD vSiM vDD_vSiM
(7mA)
Figure. LGP970 Modem Power Block Diagram
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3. TECHNICAL BRIEF
vDD_Core vDD Core
vDD_DiG / MeM
vDD_LvDS
vDD_MiPi_BGC
vDD MiPi _
vDD_rtC
vDD_USB
PMB9801
vDD_MAiN
vDD_FSYS
vDD_vAr
PMB5703 PMB5703
vBAt
MEMORY
(for Infineon)
1G / 512Mb
USIM For Infineon
Only for training and service purposes