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XM-GTR2022
Notes for Replacement of FET
Change the both channels of FETs at the output stage.
If one or both parts in the following combination is broken, the
service kit should be ordered.
Service kit part No.
Q108, 110, 112
X-3383-027-1
Q208, 210, 212
Q109, 111, 113
X-3383-028-1
Q209, 211, 213
Confi rming the Operation
Please confi rm the car audio unit works even if REM output is not
connected when you connect this set with the car audio unit by the
HIGH LEVEL input.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE
THESE
COMPONENTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
2
WITH
SONY
PARTS
TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls ......................................
Connections..........................................................................
2-1. Cover Assy .....................................................................
2-2. Top Plate Section .............................................................
2-3. AMPLIFIER Board Section .............................................
2-4. AMPLIFIER Board.......................................................... 10
2-5. LED PROT Board, LED ILLUM Board ......................... 10
4-1. Block Diagram ................................................................. 13
4-2. Printed Wiring Boards ..................................................... 14
4-3. Schematic Diagram -AMP Section (1/2)- ...................... 15
4-4. Schematic Diagram -AMP Section (2/2)- ...................... 16
5-1. Heat Sink (Main) Section ................................................ 18
5-2. AMPLIFIER Board Section ............................................. 19
3
4
8
9
9
.................................. 11
...................................... 20
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