Table Of Contents - Sony WM-FX271FP Service Manual

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WM-FX271FP
UNLEADED SOLDER
z
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
2

TABLE OF CONTENTS

........................................................................... 3
2-1. Cabinet (Front) Sub Assy .................................................... 4
2-2. Main Board ......................................................................... 5
2-3. Holder (Sub) Assy, Cassette ................................................ 5
2-4. Mechanism Deck ................................................................. 6
2-5. Belt and Motor .................................................................... 6
Tape Section ............................................................................ 7
Tuner Section ........................................................................... 8
5-1. IC Pin Description ............................................................. 10
5-2. Block Diagram .................................................................. 11
5-3. Printed Wiring Board ........................................................ 12
5-4. Schematic Diagram ........................................................... 13
6-1. Cabinet Section ................................................................. 15
6-2. Tape Mechanism Section-1 ............................................... 16
6-3. Tape Mechanism Section-2 ............................................... 17
................................. 7
........................................ 18

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