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eSpace EGW1500E Enterprise Gateway
Quick Start
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Issue 03 (2011-12-20)
Mechanical part such as shell: The steel, aluminum or copper materials contain lead.
Board and circuit module:
The PCB pad contains lead.
Ceramic capacitor or feedthrough capacitor or mica capacitor on the board: The ceramic chip
contains lead.
The resistor inside the clock oscillator is immune from lead.
The high temperature type solder, used for the connector inside the transformer, contains more than
85% lead.
The luminescence glass of chip inductor contains lead.
The high temperature type solder used for the transistor chip contains lead.
The glass of resistance layer and protection layer is immune from lead.
The pin and solder of the components such as the IC and power unit contain lead.
Signal cables: The alloy materials such as the steel, aluminum, and copper materials
contain lead.
Cable connector: For most connectors, the metal shell, terminal and pin contain lead.
Power adapter: The interior contains lead.
The circuit board of the auxiliary equipment contains lead. Same as point one and point
two.
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6 Declaration on Hazardous Substances in Electronic
Information Products
24
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