Physical And Environmental Specifications - HP rx2600 Overview

• Chipset
– HP zx1 Chipset
– 105-nanosecond memory latency
– 6.4 GB/s system bus bandwidth
– 4.0 GB/s aggregate I/O bandwidth
• Expansion slots
– 3 PCI-X on independent buses, 64-bit 133 MHz
– 6 PCI-X on 3 shared buses, 64-bit 66 MHz
– 1 PCI for graphics/USB, 64-bit 33 MHz
• Hot-plug disk drives (4 bays)
– 584 GB maximum internal storage
– 2 dual Ultra160 SCSI controllers
– Optional high-availability (duplex) configuration for internal disk drives
– Disk sizes available: 36 GB 15,000 rpm, 73 GB 15,000 rpm, 146 GB 10,000 rpm
• Removable media
– One open media bay for optional SCSI devices
– Choice of DVD-ROM or DDS-3
• Core I/O interconnect ports
– Gigabit-TX LAN with RJ-45 connector (10/100/1000BT autosensing)
– Ultra160 SCSI port for external peripherals
– Management processor interconnect
– 10/100BT management LAN with Web console access
– RS-232 local console
– RS-232 remote/modem console
– RS-232 general purpose
– 2 USB Series A 2.0 (480 Mb/s) ports (optional)
– VGA (optional)
• Power and cooling
– 2 930W hot-swap power supplies standard
– Optional third 930W hot-swap power supply for N+1 redundancy
– 8 cooling fans with N+1 redundancy
• Power requirements
– Input current: 10A at100–120V, 5A at 200–240V (voltage auto ranging)
– Line frequency: 50 Hz to 60 Hz
– Maximum power input: 1600W (conservative), 1250W (typical)

Physical and environmental specifications

• Environmental specifications
– Altitude
– Operating: 3000 m (10,000 ft.) maximum
– Storage: 4600 m (15,000 ft.) maximum
– Temperature
– Operating: +05°C to +35°C (+41°F to +95°F)
– Non-operating: –40°C to +70°C (–40°F to +158°F)
– Humidity
– Operating: 15% to 80% (relative, non-condensing)
• Physical dimensions in rack orientation
– Height: 31.1 cm (12.25 in.), 7U EIA
– Width: 48.2 cm (19 in.)
– Depth: 77.4 cm (30.5 in.)
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