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Philips Semiconductors
Logic level TOPFET
MECHANICAL DATA
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-leads
DIMENSIONS (mm are the original dimensions)
A
A 1
UNIT
4.5
1.39
mm
4.1
1.27
Notes
1. The positional accuracy of the terminals is controlled within zone L 1 max.
2. Mounting base configuration is not defined within the dimensions E and D
OUTLINE
VERSION
SOT78B
Fig.2. SOT78B (TO220AB) package
1 Refer to mounting instructions for SOT78 (TO220) envelopes. Epoxy meets UL94 V0 at 1/8". Net mass: 2 g
May 2001
E
p 1
p
D 1
D
L 1
b 1
L
1
2
3
(1)
b
e
e
0
(1)
b
b 1
c
D
D 1
0.85
1.3
0.7
15.8
6.4
0.60
1.0
0.4
15.2
5.9
REFERENCES
IEC
JEDEC
A
A 1
q
mounting
base
(2)
L 2
Q
w
M
5
10 mm
scale
L 2
e
E
L
L 1
max.
10.3
15.0
3.30
2.54
3.0
9.7
13.5
2.79
EIAJ
1
, pin 2 connected to mounting base.
5
Product specification
PIP3119-P
SOT78B
c
p 1
p
q
Q
w
3.8
4.3
3.0
2.6
0.4
3.6
4.1
2.7
2.2
EUROPEAN
ISSUE DATE
PROJECTION
01-02-22
Rev 1.000
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