IBM ThinkPad R30 Hardware Maintenance Manual page 150

No. Description
Lower Case w/ label Taiwan 2676
Lower Case w/ label India 2676
Lower Case w/ label WW-wireless
Lower Case w/ label EMEA-wireless
Lower Case w/ label IIPC-wireless
Lower Case w/ label Korea-wireless
Lower Case w/ label Taiwan-wireless
17 SoDIMM Asm. –128MB
SoDIMM Asm.—256MB
18 Actiontec IEEE 802.11b/Modem combo
card-WinXP
19 Mini-PCI / DIMM door kit
20 Battery Assy. (Ni-Mh)
Sanyo-W/W
Sanyo-Japan
Battery Assy. (Li-Ion)
Sanyo-W/W
Sanyo-Japan
Panasonic-W/W
Panasonic-Japan
21 Speaker Kit
22 RTC Battery
23 CD-ROM Module
TEAC
HLDS(LG)
DVD-ROM Module
MKE
HLDS(Hitachi)
CD-RW Module
SONY ( for WinXP)
TEAC
CD-RW/DVD-ROM combo Module
KME (Toshiba)
144
ThinkPad R30 and R31 HMM
FRU No.
46L6364
46L6374
46L6331
46L6332
46L6333
46L6334
46L6339
19K4653
19K4655
12P3637
46L6335
02K6827
02K6835
02K6822
02K6830
02K6824
02K6832
02K5989
02K7062
27L3436
27L4301
08K9648
08K9646
27L4231
08K9644
08K9694