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RM-626
System Module
The SIM interface supports both 1.8V and 3.0V SIM cards. The SIM interface voltage is first 1.8 V when the SIM
card is inserted, and if the card does not response to the ATR (Answer to Request), 3V interface voltage is
used.
Device memory
The memory components of the device are internal COMBO POP4 2Gb DDR + 8Gb M3 (NAND) and 16GB eMMC
memory which is non-removable and internal to the phone.
The device uses 16GB eMMC (D3200) external memory. The eMMC interface is a 6-wire serial/parallel data bus
which includes a clock (CLK), 4 data signals (DAT), and command (CMD) wires. The eMMC interface is completely
formed of the GENIOs of RAPU. The eMMC consists of an internal NAND controller and an MMC controller for I/
O interface. It is a dual supply device which requires VCC of 2.9V for the NAND core and VCCQ of 1.8V for the
MMC I/O interface.
BOB1.0M-b module
The BOB1.0M-b module provides full 802.11b,g & n WLAN, BT 2.1 + EDR, and FM RDS connectivity.
BOB is the name given to a generic technology release that combines WLAN, Bluetooth, and FM Rx radio on
a single monolithic IC. The phone uses BOB1.0M-b module that consists of a single chip transceiver WL1271,
plus a separate RF front end (FE) device. The BOB1.0M-b release operates in the 2.4GHz (ISM) and the
76-108MHz FM bands.
From a troubleshooting point of view, WLAN is tested separately, but BTH and FMRX are checked in parallel.
Issue 1
Figure 47 BOB1.0M-b module block diagram and application circuit
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