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Table 12-1. Surface Mounting Type Soldering Conditions (2/2)
(3) µ PD75P3116GC-8BS: 64-pin plastic LQFP (14 × 14)
Soldering
Method
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Caution
Do not use different soldering methods together (except for partial heating).
Soldering Conditions
Data Sheet U11369EJ3V0DS
µ PD75P3116
Recommended
Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
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