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LG T5100 Service Manual

LG T5100 Service Manual

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Service Manual
T5100
P/N :
Date: June, 2004 / Issue 1.0

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Summary of Contents for LG T5100

  • Page 1 Service Manual T5100 P/N : Date: June, 2004 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. * This manual provides the information necessary to install, program, operate and maintain the T5100. - 3 -...

  • Page 3: Table Of Contents

    Table Of Contents E. External Audio Codec Interface ..29 ........1. PERFORMANCE F. DSP Pin description ......30 1.1 H/W Feature ..........6 G. LCD module pin description ..... 32 1.2 Technical Specification ......7 H.Camera module pin description ..33 I.
  • Page 4 6.1.2 In case of using the PIF ....99 11.1 Setting Method ........ 135 6.2 Download Procedure ......100 11.1.1 COM Port ......135 6.3 T5100 Multimedia Chip Download ..107 11.1.2 Tx Test ......... 135 11.1.3 Rx Test ......... 135 7. Service and Calibration ....113 7.1 Service S/W ........

  • Page 5: Performance

    1. PERFORMANCE 1. PERFORMANCE 1.1 H/W Feature Item Feature Comment Standard Battery Li-ion, 950mAh AVG TCVR Current 240mA Standby Current < 4.5mA Talk time 4.8hours (GSM TX Level 7) Standby time 260 hours (Paging Period:9, RSSI: -85dBm) Charging time 2.5 hours RX Sensitivity GSM900 : -105dBm, DCS : -105dBm GSM, EGSM: 33dBm (Level 5)

  • Page 6: Technical Specification

    1. PERFORMANCE 1.2 Technical Specification Item Description Specification GSM900 TX: 890 + n x 0.2 MHz (n=1 ~ 124) 890 + (n-1024) x 0.2 MHz (n=975 ~ 1023) RX: TX + 45 MHz Frequency Band DCS1800 TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885) RX: TX + 95 MHz RMS <...
  • Page 7 1. PERFORMANCE Item Description Specification GSM900 Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000 Output RF Spectrum (due to modulation) DCS1800 Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 8 1. PERFORMANCE Item Description Specification Conduction, Emission Status Spurious Emissions Conduction, Emission Status GSM900 BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800 BER (Class II) < 2.439% @-102dBm Rx Level Report accuracy 3 dB 3 dB Frequency (Hz) Max.(dB) Min.(dB) Sending Response...
  • Page 9 1. PERFORMANCE Item Description Specification dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side tone Distortion Three stage distortion < 10% <Change> System frequency 2.5 ppm (13 MHz) tolerance <Change>32.768KHz tolerance 30ppm Standby Power consumption - Normal , 4.5mA(Mix.
  • Page 10 1. PERFORMANCE Item Description Specification Battery Bar Number Power 3.62V. 3.68V. Battery Indicator 3.74V. 3.87V. 3.88V. 0.03V 3.62V. 0.03V (Call) Low Voltage Warning 3.5V. 0.03V (Standby) Forced shut down Voltage 3.35V 0.03 V 1 Li-ion Battery Battery Type Standard Voltage = 3.7V Battery full charge voltage = 4.2V Capacity: 950mAh Switching-mode charger...

  • Page 11: Technical Brief

    2. TECHNICAL BRIEF 2. TECHNICAL BRIEF 2.1 General Description The RF part consists of a transmitter, a receiver, a synthesizer, a voltage supply and a VCTCXO part. And the main RF Chipset TRF6151 [U702] is a single-chip triple-band transceiver for the extended global system for mobile communication [GSM900MHz] /Digital communication system [DCS1800MHz] voice and data transfer applications.

  • Page 12: Rf Front End

    2. TECHNICAL BRIEF 2.2.1. RF Front End Antenna switch and dual saw filters are integrated in FEM (FL700). The Received RF signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the antenna and Mobile switch. An antenna matching circuit is between the antenna and the mobile switch.

  • Page 13: Transmitter Part

    2. TECHNICAL BRIEF Fig 2. Block Diagram of Synthesizer Part 2.4 Transmitter Part The Transmitter part contains OPLL parts of RF Main Chipset [TRF6151, U702], Power Amplifier Module [SKY77325, U709] and Front-End Module [SHS-L090SF, FL700]. The transmit section of RF Main Chipset [TRF6151, U702] consists of an I/Q base-band up-converter, an offset phase-locked loop [OPLL].

  • Page 14: If Modulator

    2. TECHNICAL BRIEF 2.4.1 IF Modulator The Baseband Converter (BBC) within the Analog Baseband Chipset [TWL3014, U101] generates I/Q baseband signals for the transmit vector modulator. The Tx-modulator implements a quadrature modulator. A quadrature mixer up-converts the differential baseband I/Q signals with the IFLO to generate a IF signal, which signal is filtered and used as the reference input to the OPLL.

  • Page 15: Power Amplifier Module

    2. TECHNICAL BRIEF GSM900 Figure 5. Block Diagram of OPLL 2.4.3 Power Amplifier Module The Power Amplifier Module [SKY77325, U709] is a dual-band GSM/DCS power amplifier module that incorporates an indirect closed loop method of power control. The indirect closed loop is fully self-contained and it does not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.

  • Page 16: 26Mhz Clock

    2. TECHNICAL BRIEF Figure 7. Schematic of PAM circuit 2.5 26MHz Clock The 26MHz clock [X700] consists of a VCTCXO [Voltage Controlled Temperature Compensated Crystal Oscillator], which oscillates at a frequency of 26 MHz. It is used within the RF Main Chip [TRF6151, U702], ABB [IOTA, U101], DBB [CALYPSO, U100].

  • Page 17: Digital Baseband

    2. TECHNICAL BRIEF 2.7 Digital Baseband Figure 10. Top level block diagram of the Calypso G2 A. General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- - Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.
  • Page 18 2. TECHNICAL BRIEF Application peripherals ARM General purposes I/O with keyboard interface and two PWM modulation signals UART 16C750 interface (UART_IRDA) with - IRDA control capabilities (SIR) - Software flow control (UART mode). UART 16C750 interface (UART_MODEM) with - hardware flow protocol (DCD, CTS/RTS) - autobaud function SIM Interface.

  • Page 19: External Devices Connected To Memory Interface

    2. TECHNICAL BRIEF C. External Devices connected to memory interface Table 2. External Device Spec. connected to memory interface Interface SPEC Write Access Device Name Maker Read Access Time Time FLASH 1-1 AM50PDL193CHH66I 70ns(min) 70ns(min) FLASH 1-2 AM50PDL193CHH66I 70ns(min) 70ns(min) Pseudo-SRAM AM50PDL193CHH66I 70ns(min)

  • Page 20: Uart Interface

    SIM_RST : SIM Card async/sync reset SIM_IO : SIM Card bi-directional data line F. UART Interface T5100 two UART Drivers as follow : - UART1 : Hardware Flow Control / Fax&Data Modem - UART2 : S/W Debugger & IrDA Modem Table 4.

  • Page 21: Gpio Map

    2. TECHNICAL BRIEF G. GPIO Map In total 16 allowable resources, T5100 is using 13 resources except 3 resources dedicated to SIM and Memory. T5100 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table 5.

  • Page 22: Analog Baseband

    2. TECHNICAL BRIEF 2.8 Analog Baseband A. General Description IOTA is Analog Baseband (ABB)Chip supports GSM900, DCS1800, PCS1900, GPRS Class 10 with Digital Basband Chip(Calypso G2). IOTA processes GSM modulation/demodulation and power management operations. Block Description - Audio Signal Processing & Interface - Baseband in-phase(I), quadrature(Q) Signal Processing - RF interface with DBB (time serial port) - Supply voltage regulation...

  • Page 23: Baseband Codec(Bbc)

    VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.85 SIM card driver VRRTC 1.5V RTC & 32kHz-crystal Figure 15 shows the power supply related blocks of DBB/ABB and their interfaces in T5100 - 24 -...
  • Page 24 2. TECHNICAL BRIEF Figure 15. Power Supply Scheme - 25 -...

  • Page 25: Adc Channels

    HOOK_DETECT Jack & Hook Detect F. Switch ON/OFF T5100 Power State : Defined 4cases as follow - Power-ON : mobile is powered by main battery or backup battery. - Power-OFF : mobile isn't powered by any battery. - Switch-ON : mobile is powered and waken up from switch-off state.

  • Page 26: Usb

    Instead of using external storage card(ex,smart media card,memory stick..) ,T5100 include internal large nand flash memory(256Mbit). To download a mount of image data from phone , T5100 supports USB communication.And it is compatible with USB specification versions 1.0 and 1.1, Figure 16.

  • Page 27: C.external Memory Interface

    SH7300 chip includes AND/NAND Flash Memory Controller (FLCTL), bus state controller (BSC) which connect directly with SRAM, SDRAM, and other memory storage devices, and external devices. T5100 uses MCP type memory(NAND 256 Mbit + SDRAM 128Mbit) for processing image,storing image.

  • Page 28: External Audio Codec Interface

    SH7300 chip. In camera power down mode,SH7300 controls its GPIO pin(Net name :CAM_PWR_EN) as ‘LOW’. T5100 has a special white LED for camera flash function. This function is controlled by GPIO of DBB And the scheme is described at (Figure 18).

  • Page 29: Dsp Pin Description

    2. TECHNICAL BRIEF U301 : Audio Codec,U303: 3.3V output regulator ,U302: Audio digital amplifier ,U707:Analog switch, X300 : 12.288 MHz crystal Oscillator The codec inputs are three path, one is from MIDI output, another is from ABB ear_out, another is from SH7300 via PCM Interface.
  • Page 30 2. TECHNICAL BRIEF Signal Description Connection FLASH_EN Camera Flash enable Camer Module C_PWDN Camera power down _CAM_ON DSP_IRQ Dsp interrupt DBB(calypso) _ASEB Emulator Break JTAG Emulator _AUDATA3 Audio data JTAG Emulator _AUDATA2 Audio data JTAG Emulator _AUDATA1 Audio data JTAG Emulator _AUDATA0 Audio data JTAG Emulator...

  • Page 31: Lcd Module Pin Description

    2. TECHNICAL BRIEF Signal Description Connection _RAS SDRAM Row access strobe SDRAM NAND bank address1 SDRAM NAND bank address0 SDRAM V_A(1:12) SH bus address SDRAM V_D(0:15) SH bus data LCD,SDRAM G. LCD module pin description LCD module is connected to main board with 40 pin FPCB. And LCD module includes Receiver. Table 9.

  • Page 32: H.camera Module Pin Description

    2. TECHNICAL BRIEF Pin Name Function Ground Ground V_D(15) Data input V_D(14) Data input V_D(13) Data input V_D(12) Data input V_D(11) Data input V_D(10) Data input V_D(9) Data input V_D(8) Data input _WEM Write strobe _LCD_CS LCD Chip select _VA(2) Command / Data selection LCD_IFMODE LCD Interface mode selection(18bit/16bit)

  • Page 33: Keypad Connector Pin Description

    2. TECHNICAL BRIEF Pin Name Function YUV7 Camera data C_VSYNC Camera Vsync control C_HSYNC Camera Hsync control I2C data I2C clock C_RESET Camera reset 1.8V Power supply for core 2.8V Power supply for analog Ground 2.8V Power supply for I/O VLED1 FLASH LED1 VLED2...
  • Page 34 2. TECHNICAL BRIEF Pin Name Function Ground Ground PWON END KEY INPUT Ground 2V8_RIO 2.8 V GROUND KBC(0) Key Column output KBC(1) Key Column output KBC(2) Key Column output KBC(3) Key Column output KBC(4) Key Column output Ground VBAT Battery voltage VBAT Battery voltage Ground...

  • Page 35: Baseband Part Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3. BASEBAND PART TROUBLE SHOOTING 3.1 Main PCB side components - 1 CN501 U101 X700 U704 U702 CN401 FL700 SW404 CN502 U708 U501 U402 J500 X100 U100 U201 BAT100 CN400 Figure 21. Main PCB side components - 1 Table 12.

  • Page 36: Main Pcb Side Components - 2

    3. BASEBAND PART TROUBLE SHOOTING U100 D751992GHH DBB Solution (Calypso) U201 AM50PDL193CH66I NOR Flash Memory + PSRAM BAT100 PB-414SR 12K BackupBattery CN400 KQ03B-3R Main Battery Connector 3.2 Main PCB side components - 2 U302 U301 X300 U300 U712 U711 X200 U200 CN200 U303...
  • Page 37 3. BASEBAND PART TROUBLE SHOOTING U303 SI9182DH-33 LDO 3.3V for Audio Codec U604 K5D5629CCM-F095 NAND Memory + SDRAM U500 AAT3123ITP-20 LCD Backlight Drive IC MIC300 OBG415L30-C33 U603 PCA9535BS GPIO Expander X600 FA-238-30MHz 30MHz X-tal U602 D17300BLZ120V DSP (For Video Processing) U600 MIC2211-FMBML LDO 1.5V 2.8V for DSP...

  • Page 38: Keypad Side Components

    3. BASEBAND PART TROUBLE SHOOTING 3.3 Keypad side components Figure 23. Key Pad side components Table 14. Part description Reference Part # Description AXN730535J Board-to-Board Connector KJA-PH-3-0059 Ear Jack A3212ELH Hall-Effect Switch (For On/Off) A3212ELH Hall-Effect Switch (For Reverse) - 39 -...

  • Page 39: Power-On Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.4 Power-On Trouble Power-On Sequence - Connecting Battery - Power-On Key Detection - PWON signal goes to ABB and then ABB resets DBB by ONNOFF signal - ONNOFF turns low(0V) to High(2.8V) and it resets DBB(Calypso) - All LDOs(internal LDOs of ABB and external LDOs) are turned on Check Points - Battery Voltage...
  • Page 40 3. BASEBAND PART TROUBLE SHOOTING Block Diagram Ch ar gin g C urren t FB40 0 Q200 B atte r y VCHG FB40 1 VCHG IC TL R200 IOT A PCHG VCCS D200 U101 VBATS R201 VBAT CN 401 C212 Figure 25.
  • Page 41 3. BASEBAND PART TROUBLE SHOOTING START Resolder the CN401 (Pin 4,5 : VCHG, I/ O Connect or (CN401) Is soldered well? Pin 12, 19, 25, 26 : GND) Voltage at p in 4, 6 of Q200 The TA is out o f order. = 5.2 V ? Change the TA Q200, D200, R201 are...

  • Page 42: Lcd Display Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.6 LCD Display Trouble (Main PCB) (LCD Module) (Main Board) Check soldering around connector If the FPCB has a problem, the control signals for LCD cannot be transmitted properly Figure 26. LCD Module LCD Control signals from Main Board - LCD_RESET, _LCD_CS, _WEM, LCD_BL_EN, LCD_ID, LCD_IFMODE, V_A(2), V_D(0) ~ V_D(15) Check Points...
  • Page 43 3. BASEBAND PART TROUBLE SHOOTING LCD_RESET R502 GPIO Expander LCD_IFMODE (PCA9535BS) R770 LCD_ID R750 (D751992GHH) LCD_BL_EN CN501 _LCD_CS FL500 _WEM FL501 V_A(2) FL503 (D17300BLZ120V) FL505 FL506 V_D(0) ~ V_D(15) Figure 27. LCD Module Block Diagram - 44 -...
  • Page 44 3. BASEBAND PART TROUBLE SHOOTING START Refer to Power On Power is supplied to the board ? trouble Connection between FPCB and Reconnect FPCB board is OK? Resolder the CN501 CN501 is soldered well? Resolder the R502, R750, Paths of LCD control signals are R770,FL500,FL501, FL503,FL505,FL506 Replace the FPCB...

  • Page 45: Speaker/Receiver Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.7 Speaker/Receiver Trouble Figure 28. Speaker/Receiver Trouble Melody Generation - U300(YMU762:MIDI IC) is controlled by DBB(Calypso) - U300 generates 40-poly MIDI sound and it is delivered to U301(TLV320AIC23BGQE:Ext-Audio Codec) - U301(controlled by Calypso) operates filtering and amplifying the delivered MIDI sound and outputs these signals to Analog switch IC(U707).
  • Page 46 3. BASEBAND PART TROUBLE SHOOTING Trouble shooting Procedure - Check the audio signal level at each points - Check the soldering of the connector - Check the soldering of the receiver R822 R823 CN501 RCV_N RCV_P Figure 29. Receiver - 47 -...
  • Page 47 3. BASEBAND PART TROUBLE SHOOTING Receiver Trouble START Set audio part at test equipment as PBRS or continuous wave, not echo. . Set the audio volume Max. ABB is out of order. Doe s sine wave appear at R822, R823? Change the Board .
  • Page 48 3. BASEBAND PART TROUBLE SHOOTING R340 R333 C315 C306 R334 R335 R341 U302 U707 TP304 TP303 U301 U300 CN502 VA503 VA502 Figure 30. Speaker - 49 -...

  • Page 49: Speaker Trouble

    3. BASEBAND PART TROUBLE SHOOTING Speaker Trouble START Enter into engineering mode and go to menu[Baseband alert ring Does sine wave appear U300 is out of order. Change the Board. at C306, C315? Does sine wave appears U301 is out of order. Change the Board.

  • Page 50: Microphone Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.8 Microphone Trouble Figure 31. Mic Circuit Microphone Signal Flow - MIC is enabled by MICBIAS - MICBIAS is supplied from ABB(IOTA) - MICP, MICN signal to ABB(IOTA) Check Points - Microphone bias level - Audio signal level of the microphone - Soldering of components MICP MICN...

  • Page 51: Earphone Trouble

    3. BASEBAND PART TROUBLE SHOOTING Microphone Trouble START Connect the handset to network equipment and setup call The voltage of MICP = 1.8V ? The soldering of R329 is OK ? Check the signal level at MICP,MICN after ABB is out of order. Resolder R329 putting audio signal Change the board...
  • Page 52 3. BASEBAND PART TROUBLE SHOOTING Earphone Detecting Operation - The ABB operates A/D conversion continuously and if the voltage of “ADIN4” node goes below 1.3V, it detects earphone insertion. - The ABB operates A/D conversion continuously and if the voltage of “ADIN4” node goes below 0.4V, it detects hook-switch of earphone is pushed.
  • Page 53 3. BASEBAND PART TROUBLE SHOOTING Sending Path Problem Set audio menu of test equipment to the echo mode Resolder R332 The voltage level at R332 is? The soldering Resolder J1 and Try again of J1 is OK ? The soldering Resolder CN500 and of CN500 is OK ? Reconnect...
  • Page 54 3. BASEBAND PART TROUBLE SHOOTING R301 R302 R300 C107 U300 C108 L 500 L 501 L 502 CN500 Figure 34. Earphone path - 55 -...

  • Page 55: Vibrator Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.10 Vibrator Trouble Block Diagram VBAT VBAT YMU762 U300 L200 MOTOR CN200 R219 R218 U204 VIBRATOR Figure 35. Vibrator Circuit Vibrator Operation - Vibrator is controlled by MIDI Chip (U300) - When vibrator signal is high, vibrator is enabled Check Points - VDD lines of MIDI Chip - Vibrator signal path...
  • Page 56 3. BASEBAND PART TROUBLE SHOOTING - Enter into Engineering mode - Go to menu “Baseband Alert Vibrator” Trouble Shooting Procedure - Check vibrator signal - Check soldering of components - Check Board-to-board connector - Check vibrator L200 R219 CN200 U204 R218 Figure 36.

  • Page 57: Keypad Backlight Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.11 Keypad Backlight Trouble Backlight Operation - The Keypad LED Backlight is controlled with LEDB signal from ABB(IOTA) - The LEDs are forward biased and turned on Check Points - LEDB signal - LEDs Trouble Shooting Setup - Connect PIF-UNION Jig to the phone, and Power on - Enter Engineering mode - Go to menu “Baseband...
  • Page 58 3. BASEBAND PART TROUBLE SHOOTING Keypad Backlight Trouble (Case of all LEDs are not working) START Enter into Engineering Mode and select Keypad On The Voltage of LED signal ABB is out of order. is abou t 0V? Power off and Measure the Resistor Value of all LEDs.

  • Page 59: Folder On/Off And Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.12 Folder On/Off and Trouble Block Diagram (Folder On/Off) Folder1 CALYPSO U100 Component Side Keypad Side Block Diagram (Folder Reverse) Folder2 CALYPSO U100 Component Side Keypad Side Figure 38. Folder on/off - 60 -...
  • Page 60 3. BASEBAND PART TROUBLE SHOOTING Folder Operation(ON/OFF) - There is a magnet to detect the folder status, opened or closed. - If a magnet is close to the hall-effect switch(U1) the voltage at pin 2 of U1 goes to 0V. Otherwise, 2.8V - If a folder signal(Folder1) goes to 0V, RPWON signal goes to 2.8V.
  • Page 61 3. BASEBAND PART TROUBLE SHOOTING Folder Trouble (On/Off) START The all paths connected Resolder the R29 to U1 are OK? Refer to Power On The 2V8_RIO is 2.8V? Trouble. Replace the U1. Folder1 signal is low on U1 is broken. magnetizing into U1? The DBB(Calypso) is broken.

  • Page 62: Sim Detect Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.13 SIM Detect Trouble Block Diag ram DBB(U100 ) 2V8 RIO ABB(U101) V SIM VRSIM SIM_IO DBBSIO R500 SIM(J 500 ) ) SIM_CLK DBBSCK SIM_RST DBBSRST R114 SIM_PWRCTRL S IMCLK SIM_CD SIMIO R111 SIMRST R112 DSP_INT C523 C505...
  • Page 63 3. BASEBAND PART TROUBLE SHOOTING Connection between SIM and DBB - SIM_CLK, SIM_IO, SIM_RST Pin3 Pin6 Check Points - Contact between SIM and socket - Soldering of SIM socket Trouble Shooting Pin1 Pin4 - Insert the SIM into socket - Connect PIF_UNION Jig to the phone, and Power on Figure 41.

  • Page 64: Camera Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.14 Camera Trouble Block Diagram 1.8V 2.8V YUV0_7 (D751992GHH) USBN C_MCLK 9604SBL. Camera (SXGA) C_Vsync GPIO C_Hsync C_PCLK Figure 42. Camera Block Diagram Camera Flash Operation - Camera is operated by Power(2.8V), C_MCLK(24MHz-QVGA/48MHz-SXGA) - Camera Signals divided by C_MCLK, are C_Vsync, C_Hsync, and C_PCLK - FLASH_EN makes INT(Interrupt) by combining C_Vsync, C_Hsync, and C_PCLK - Camera serial communication is I2C.
  • Page 65 3. BASEBAND PART TROUBLE SHOOTING Camera Trouble START Does the LCD itself have Go to the LCD no trouble? Set the camera button ON Check Power Source Check U601 Change U601 2.8V & 1.8V 2V8_CAM Check U708 Change U708 1.8V X200 is out of order C_MCLK waveform? X200 ?

  • Page 66: Camera Flash Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.15 Camera Flash Trouble Block Diag ram LM2750 LDX_5.0 FLASH_EN Camera Flash Operation - Camera Flash is operated with LM2750_DX(5.0V) - The Chip-Select of LM2750_DX is Low_signal which come by FLASH_EN(DBB).- - The LEDs are forward biased and turned on. Check Points - Signal : FLASH_EN - LED...
  • Page 67 3. BASEBAND PART TROUBLE SHOOTING Camera Flash Trouble START Press VOD-key Set Camera on And then turn flash on at Menu High signal Appear DBB is out of order at the R800? Change the Board The voltage of U501 U501 is out of order is about 4.5V? Change the U501 LED is out of order...

  • Page 68: Infrared Data Association Trouble

    3. BASEBAND PART TROUBLE SHOOTING 3.16 Infrared Data Association Trouble Block Diagram VBAT R416 IrDA TX_IrDA UART RX_IrDA IrDA (CALYPSO) SD_IrDA 2V8_RIO Figure 45. IrDA Block Diagram Infrared Signal Flow - Infrared is enable by SD - TX_IrDA,RX_IrDA,SD_IrDA signals from DBB Check Points - Check the power supply.
  • Page 69 3. BASEBAND PART TROUBLE SHOOTING IrDA Trouble START Execute PCSync program Resolder the R416 The power is supplied to U402? The soldering of U402 is OK? Resolder the U402 The signal "TX _IrD A, R X_ Ir D A" Change the U402 are measured? The DBB is broken.

  • Page 70: Rf Part Troubleshooting

    4. RF PART TROUBLESHOOTING 4. RF PART TROUBLESHOOTING 4.1 RF Components X700 U704 U702 U709 U703 FL700 SW404 Figure 47. RF Components Table 15. RF Components Reference Description Referencen Description SW404 Mobile S/W U704 LDO [Voltage Regulator] FL700 FEM [Front End Module] X700 VCTCXO [26MHz] U703...

  • Page 71: Trouble Shooting Of Receiver Part

    4. RF PART TROUBLESHOOTING 4.2 Trouble Shooting of Receiver Part Figure 48. RF - 72 -...

  • Page 72: Checking Ldo Circuit

    4. RF PART TROUBLESHOOTING 4.2.1 Checking LDO Circuit Checking Points Checking Flow Pin 5 : RF2.85V U100 is out of order. Pin3? change the board U704 Replace U704 Pin5? Pin 3 : RF_EN Figure 49. LDO Redownload The phone LDO Circuit Diagram Waveform Figure 50.

  • Page 73: Checking Vctcxo Circuit

    4. RF PART TROUBLESHOOTING 4.2.2 Checking VCTCXO Circuit Checking Points Checking Flow Is the waveform Replace X700 of Pin3 similar to Fig.54? X700 Is the waveform Replace U702 of Pin 47 similar to Fig.55? VCTCXO Circuit is Pin 3 Pin 47 Figure 52.

  • Page 74: Checking Rf Chipset Control Signal

    4. RF PART TROUBLESHOOTING 4.2.3 Checking RF Chipset Control Signal Checking Flow Checking Points Redownload Similar Fig58? The phone S/W DATA U702 STROB Control Signals is OK See next page to check Figure 56. RF Chipset Control Signal Circuit Diagram Figure 57.

  • Page 75: Checking Mobile S/W And Fem Circuit

    4. RF PART TROUBLESHOOTING 4.2.4 Checking Mobile S/W and FEM Circuit Checking Points Pin2 Pin1 (VC3) (VC1) (VC2 Figure 59. FEM Mobile S/W & FEM Circuit Diagram Figure 60. FEM Circuit - 76 -...
  • Page 76 4. RF PART TROUBLESHOOTING Checking Flow Check Pin 1,2 of SW404 with Replace SW404 RF Cable : Open? For this RF level test case, Rx Stand alone mode is needed VC1 : Low Redownload VC2 : Low The Phone S/W VC3 : Low Check RF Level of FEM Output...

  • Page 77: Checking Rx Iq Circuit

    4. RF PART TROUBLESHOOTING 4.2.5 Checking Rx IQ Circuit Checking Points Checking Flow Similar Replace Fig63? U702 Rx IQ is OK Wavefrom U702 RXQN RXQP RXIP RXIN Figure 61. RX I/Q Rx IQ Circuit Rx IQ data Figure 62. RX I/Q Circuit Figure 63.

  • Page 78: Trouble Shooting Transmitter Part

    4. RF PART TROUBLESHOOTING 4.3 Trouble Shooting Transmitter Part Checking Flow Checking Points Setup Test Equipment GSM900 62CH, 5-Level DCS1800 700CH, 0-Level Check point Check point VCTCXO Check point RF Chipset Control Signal Check point TX IQ Check point Figure 64. PAM Check point Mobile S/W &...

  • Page 79: Checking Ldo Circuit

    4. RF PART TROUBLESHOOTING 4.3.1 Checking LDO Circuit - See RX Part “Check LDO Circuit” 4.3.2 Checking VCTCXO circuits - See RX Part “Check VCTCXO Circuit” 4.3.3 Checking RF Chipset Control Signals - See RX Part “Check RF chipset control signal” - 80 -...

  • Page 80: Checking Tx Iq Signals

    4. RF PART TROUBLESHOOTING 4.3.4 Checking Tx IQ signals Checking Points Checking Flow Similar Replace Fig67? U702 Tx IQ is OK Go to the next stage Waveform U702 TXQN TXQP TXIP TXIN Figure 65. TX I/Q Tx IQ Circuit Diagram Fig.

  • Page 81: Check Pam Circuits

    4. RF PART TROUBLESHOOTING 4.3.5 Check PAM circuits Checking Points Checking Flow Similar Redownload The Phone S/W Fig 69? GSM Out 33dBm? DCS Out 30dBm? U709 U709 is out of order. change U709 Tx IQ signals are OK. Go to the next stage GSM Out DCS Out Tx PAM Circuit Diagram...

  • Page 82: Checking Mobile S/W & Fem Circuits

    4. RF PART TROUBLESHOOTING 4.3.6 Checking Mobile S/W & FEM circuits - See RX Part “Check Mobile S/W & FEM circuit” Checking Flow Check Pin 1,2 of SW404 with Replace SW404 RF Cable : Open? For this RF level test case, Rx Stand alone mode is needed GSM?

  • Page 83: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION 5.1 Disassembly - 84 -...
  • Page 84 5. DISASSEMBLY INSTRUCTION - 85 -...
  • Page 85 5. DISASSEMBLY INSTRUCTION - 86 -...
  • Page 86 5. DISASSEMBLY INSTRUCTION - 87 -...
  • Page 87 5. DISASSEMBLY INSTRUCTION - 88 -...
  • Page 88 5. DISASSEMBLY INSTRUCTION - 89 -...
  • Page 89 5. DISASSEMBLY INSTRUCTION - 90 -...
  • Page 90 5. DISASSEMBLY INSTRUCTION - 91 -...
  • Page 91 5. DISASSEMBLY INSTRUCTION - 92 -...
  • Page 92 5. DISASSEMBLY INSTRUCTION - 93 -...
  • Page 93 5. DISASSEMBLY INSTRUCTION - 94 -...
  • Page 94 5. DISASSEMBLY INSTRUCTION - 95 -...
  • Page 95 5. DISASSEMBLY INSTRUCTION - 96 -...
  • Page 96 5. DISASSEMBLY INSTRUCTION - 97 -...
  • Page 97 5. DISASSEMBLY INSTRUCTION - 98 -...

  • Page 98: Download

    6. Download 6. Download 6.1 Download Setup 6.1.1 In case of using the Data kit Figure 6-1 Describes Download Setup Preparation · Target Handset (T5100) · Data kit · Battery · IBM compatible PC supporting RS-232 with Windows 98 or newer If you use data kit, you should have a battery with the voltage above 3.7V.

  • Page 99: Download Procedure

    6. Download 6.2 Download Procedure 1. Execute Fluid_GUI.exe and select “Erase/Program flash” menu. - 100 -...
  • Page 100 6. Download 2. Click the “Add” button. Then, choose m0 file which is going to download. - 101 -...
  • Page 101 6. Download 3. You must choose three programming options in programming options box. One is to decide whether you erase entire flash. If m0 file which is going to download have the change of pcm structure for current target’s m0 file, you must erase entire flash memory. The second programming option is to decide whether you erase bootloader.
  • Page 102 6. Download 4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below. - 103 -...
  • Page 103 6. Download 5. After checking programming options, Click “Erase/Program” button. If you click “Erase/Program” button, you will be able to see that “(reset target)” is displayed in the “Output” window. And then if you push shortly the “Power key” of the mobile, downloading will be started. - 104 -...
  • Page 104 6. Download 6. Wait for downloading to be finished. - 105 -...
  • Page 105 6. Download 7. If downloading is finished, we can switch on the mobile. When you switch on the mobile first time after downloading, you must not remove the battery until switch-on procedure is completed. If you remove the battery before switch-on procedure is completed, we will not be able to save user data in the flash memory of the mobile.

  • Page 106: T5100 Multimedia Chip Download

    Reconnect phone 5. Sticker Downlad success? 6. Reboot Phone ( T5100 Multimedia Chip Download ) Note : After step 2(DSP Format), you should not power off the phone before completing the step 3. It makes DSP file system corrupted. - 107 -...
  • Page 107 6. Download 1. Execute T5100_Manager.exe and Click °∞1. USB Check°± button. 2. Click “2. DSP Format” button. You should not power off the phone before completing the step 3. It makes DSP file system corrupted. - 108 -...
  • Page 108 6. Download 3. Click the “3. DSP Boot Download” button. Then, choose bin file which is going to be download. - 109 -...
  • Page 109 6. Download 4. You will be able to see the progress bar while DSP Boot bin file is Downloading. 5. Click “4. Reboot Phone” button after downloading. This step is just to inform you that you should reboot phone. This step does not make rebooting process automatically. - 110 -...
  • Page 110 6. Download 5. Click “5. Sticker Download” button. Then, choose bin file which is going to be download. - 111 -...
  • Page 111 6. Download 6. You will be able to see the progress bar while Sticker bin file is Downloading. 7. Click “6. Reboot Phone” button after downloading. This step is just to inform you that you should reboot phone. This step does not make rebooting process automatically. - 112 -...

  • Page 112: Service And Calibration

    7. Service and Calibration 7. Service and Calibration 7.1 Service S/W 7.1.1 Overview This service S/W is used for Calibration and Standalone test. 7.1.2 Hardware and Software Environment · More than 486 computer · 16Mbyte RAM · Remained more than 10Mbyte in Hard Disk Memory ·...
  • Page 113 A. Target System Frame This is for initializing the target phone. When you use this program to test T5100 phone, you have to initialize target at first. To initialize target phone, select target (T5100 is default) and COM port used at your computer and then click the Initialize button.
  • Page 114 7. Service and Calibration Beacon Freq. Setting (BCH) You can set BCH of phone. The number means ARFCN of base station broadcasting channel. Power Level Setting First, you have to choose operating mode (GSM or DCS) according to TCH and BCH frequency that you selected before.

  • Page 115: Calibration

    7. Service and Calibration 7.2 Calibration 7.2.1 Overview The calibration values of the phone reside on the Flash. The contents of the Flash can be read by the service software and saved as a file. This is advisable when there is need to retain that information, e.g.

  • Page 116: Equipment Setup

    7. Service and Calibration 7.2.3 Equipment Setup GSM Test Set(8960) GPIB Cable Mobile Switch Cable Power Supply GPIB Cable Battery Simulator Figure 7-1 Calibration Equipment List 7.2.4 Calibration steps A. RX Calibration In order for the RSSI measurements to be within the GSM specifications, some calibration is necessary.
  • Page 117 7. Service and Calibration f) Click the PM Start button. g) Repeat above procedure until the displayed number in Power Measurement window is 12. h) Click the Calculate button, then the service software calculate the channel compensation parameters. i) Saving updated calibration data into phone by clicking Calib Saving button. NOTE If the calibration does not done for all channels, 5 channels for EGSM900 and 7 channels for DCS1800, the service software reports, “Please execute after measuring the PM”.
  • Page 118 7. Service and Calibration Table 6-2 TX Target Powers Power Level Procedure a) Initialize phone by clicking Initialize button. b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause you have to match test equipment’s BCH and TCH ARFCN with this value.

  • Page 119: Test Jig Operation

    7. Service and Calibration 7.2.5 Test JIG Operation JIG Power Equipment Description Power Supply Usually 4.0V DC Adaptor 9.5V, 500mA JIG DIP Switch Switch Number Name Description Switch 1 ADI_REMOTE In On state phone is awaked. Not used OFF state Switch 2 TI_REMOTE In On state phone is awaked.

  • Page 120: Circuit Diagram

    8.CIRCUIT DIAGRAM 8.1 RF Interface - 121 -...

  • Page 121: Baseband Interface

    8.2 Base Band Interface - 122 -...

  • Page 122: Lcd Connector, Camera Connector, Keypad Connector

    8.3 LCD Connector, Camera Connector, Keypad Connector 1 I NOUT_A1 I NOUT_B1 9 8 I NOUT_A2 I NOUT_B2 3 I NOUT_A3 I NOUT_B3 7 6 I NOUT_A4 I NOUT_B4 I NOUT_A1 I NOUT_B1 2 I NOUT_A2 I NOUT_B2 8 7 I NOUT_A3 I NOUT_B3 4 I NOUT_A4...

  • Page 123: Dsp

    8.4 DSP N9 NC2 3 150mA 300mA 150mA 300mA - 124 -...

  • Page 124: Memory Interface, Usb Interface

    8.5 Memory Interface, USB interface Fe r r i t e b e a d BLM1 8 PG1 2 1 SN1 D - 125 -...

  • Page 125: Midi, Audio

    8.6 MIDI, Audio - 126 -...

  • Page 126: I/O Receptacle, Usb Interface, Irda Interface

    8.7 I/O Receptacle, USB Interface, IrDa Interface - 127 -...

  • Page 127: Keypad

    8.8 Keypad - 128 -...

  • Page 128: Pcb Layout

    9. PCB LAYOUT 9.1 Main Top - 129 -...

  • Page 129: Main Bottom

    9.2 Main Bottom - 130 -...

  • Page 130: Keypad Top

    9.3 Keypad Top - 131 -...

  • Page 131: Keypad Bottom

    9.4 Keypad Bottom - 132 -...

  • Page 132: Engineering Mode

    10. Engineering Mode 10. Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*# ” Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’...
  • Page 133 [2-8-4-1-2] Sidetone [2-8-4-2] Keytone [2-8-4-1-1] Link Volume [2-8-4-1-2] Sidetone [2-8-4-3] Echo Control [2-9] Irda Test [3] S/W Version [3-1] T5100 Vers [3-2] DSP Version [4] Eng Mode [4-1] Cell Environ. [4-2] Location Info [4-3] Layer1 Info [5] Factory Default - 134 -...

  • Page 134: Standalone Test

    11. Standalone Test 11. Standalone Test 11.1 Setting Method 11.1.1 COM Port In the “Dialog Menu”, select the values as explained below. · Port : select a correct COM port · Baudrate : 38400 · Leave the rest as default values 11.1.2 Tx Test 1.

  • Page 135: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 136 -...
  • Page 136 12.1 EXPLODED VIEW - 137 -...

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