Table Of Contents - LG T5100 Service Manual

1. PERFORMANCE
1.1 H/W Feature ............................................ 6
1.2 Technical Specification ........................... 7
2. TECHNICAL BRIEF
2.1 General Description .............................. 12
2.2 Receiver Part ........................................ 12
2.2.1. RF Front End .............................. 13
2.2.2 Demodulator and base-band
processing .................................... 13
2.3 Synthesizer Part .................................... 13
2.4 Transmitter Part .................................... 14
2.4.1 IF Modulator ................................. 15
2.4.2 OPLL ............................................ 15
2.4.3 Power Amplifier Module ............... 16
2.5 26MHz Clock ......................................... 17
2.6. Power Supplies [LDO] .......................... 17
2.7 Digital Baseband ................................... 18
A. General Description .......................... 18
B. Block Description .............................. 18
C. External Devices connected to
memory interface .............................. 20
D. RF Interface (TPU, TSP block) ......... 20
E. SIM interface .................................... 20
F. UART Interface ................................. 21
G. GPIO Map ........................................ 22
2.8 Analog Baseband .................................. 23
A. General Description .......................... 23
B. Audio Signal Processing & Interface
........................................................... 23
C. Baseband Codec(BBC) .................... 24
D. Voltage Regulation(VREG) .............. 24
E. ADC Channels .................................. 26
F. Switch ON/OFF ................................. 26
G. Memories ......................................... 26
2.9 USB ....................................................... 27
2.10 DSP (For Video related process) ........ 27
A. General Description .......................... 27
B. Power circuit ..................................... 27
C.External Memory Interface ................ 28
D.Video Interface .................................. 28

Table Of Contents

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............................
12
E. External Audio Codec Interface ........ 29
6
F. DSP Pin description .......................... 30
G. LCD module pin description ............. 32
H.Camera module pin description ......... 33
I. Keypad Connector pin description ..... 34
3. BASEBAND PART TROUBLE
SHOOTING
....................................................................
3.1 Main PCB side components - 1 ............. 36
3.2 Main PCB side components - 2 .............. 37
3.3 Keypad side components ...................... 39
3.4 Power-On Trouble ................................. 40
3.5 Charging Trouble .................................. 40
3.6 LCD Display Trouble ............................. 43
3.7 Speaker/Receiver Trouble .................... 46
3.8 Microphone Trouble .............................. 51
3.9 Earphone Trouble ................................. 52
3.10 Vibrator Trouble .................................. 56
3.11 Keypad Backlight Trouble ................... 58
3.12 Folder On/Off and Trouble .................. 60
3.13 SIM Detect Trouble ............................. 63
3.14 Camera Trouble ................................... 65
3.15 Camera Flash Trouble ......................... 67
3.16 Infrared Data Association Trouble ........ 69
4. RF PART TROUBLESHOOTING
....................................................................
4.1 RF Components ..................................... 71
4.2 Trouble Shooting of Receiver Part ......... 72
4.2.1 Checking LDO Circuit .................. 73
4.2.2 Checking VCTCXO Circuit ........... 74
4.2.3 Checking RF Chipset Control
Signal ........................................... 75
4.2.4 Checking Mobile S/W and FEM
Circuit ........................................... 76
4.2.5 Checking Rx IQ Circuit ................. 78
4.3 Trouble Shooting Transmitter Part ......... 79
4.3.1 Checking LDO Circuit .................. 80
4.3.2 Checking VCTCXO circuits .......... 80
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