HP G4 Maintenance And Service Manual page 90

6. Remove the three Phillips PM2.5×5.0 screws (2) and the four Phillips PM2.5×10.0 spring-loaded
screws (3) that secure the heat sink to the system board.
NOTE:
system board components, it may be necessary to move the heat sink from side to side to
detach it.
7. Remove the fan and heat sink (4).
NOTE:
and the system board components each time the heat sink is removed. Replacement
thermal material is included with the base enclosure, heat sink, processor, and system board
spare part kits.
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it (only on computer models equipped with a graphics subsystem with
discrete memory)
82 Chapter 4 Removal and replacement procedures
Due to the adhesive quality of the thermal material located between the heat sink and
The thermal material must be thoroughly cleaned from the surfaces of the heat sink