System board
CAUTION:
covers to prevent damage to the processor sockets and system board.
To remove the component:
Power down the server blade (on page 23).
1.
Remove the server blade (on page 24).
2.
Remove the access panel
3.
Remove all hard drives ("Drive" on page 26).
4.
Remove all hard drive blanks
5.
Remove the front panel/drive cage assembly
6.
Disconnect the capacitor pack cabling, if connected
7.
Remove the SAS controller
8.
Remove all DIMM baffles
9.
Remove all DIMMs ("DIMMs" on page 29).
10.
Remove the FlexibleLOM ("FlexibleLOM" on page 35).
11.
Remove the heatsink ("Heatsink" on page 50).
12.
Open each of the processor locking levers in the order indicated, and then open the processor retaining
13.
bracket.
When returning a damaged system board to HP, always install all processor socket
("Access
panel" on page 25).
("Drive
blank" on page 26).
("SAS
controller" on page 38).
("DIMM
baffles" on page 28).
("Front panel/drive cage
("FBWC capacitor pack
Removal and replacement procedures 57
assembly" on page 49).
cabling" on page 71).