Intel E5205 - Cpu Xeon 1.86Ghz Fsb1066Mhz 6M Lga771 Dual Core Tray Datasheet page 76

The Dual-Core Intel® Xeon® Processor E5200 Series and Dual-Core Intel® Xeon®
Processor L5200 Series supports a single Thermal Profile (see
Table 6-1Table
Circuit (TCC) would only be activated for very brief periods of time when running the
most power-intensive applications. Refer to the Dual-Core Intel® Xeon® Processor
5200 Series Thermal/Mechanical Design Guidelines (TMDG)for details on system
thermal solution design, thermal profiles and environmental considerations.
The Dual-Core Intel® Xeon® Processor L5238 supports a Thermal Profile with nominal
and short-term conditions designed to meet NEBS level 3 compliance (see
Operation at either thermal profile should result in virtually no TCC activation. Refer to
the Dual-Core Intel® Xeon® Processor 5200 Series in Embedded Thermal/Mechanical
Design Guidelines (TMDG).
The Dual-Core Intel® Xeon® Processor X5200 Series supports a dual Thermal Profile,
either of which can be implemented. Both ensure adherence to the Intel reliability
requirements. Thermal Profile A (see
volumetrically unconstrained thermal solution (that is, industry enabled 2U heatsink).
In this scenario, it is expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power intensive
applications. Thermal Profile B (see
thermal environment (that is, 1U form factor). Because of the reduced cooling
capability represented by this thermal solution, the probability of TCC activation and
performance loss is increased. Additionally, utilization of a thermal solution that does
not meet Thermal Profile B will violate the thermal specifications and may result in
permanent damage to the processor. Intel has developed these thermal profiles to
allow customers to choose the thermal solution and environmental parameters that
best suit their platform implementation. Refer to the Dual-Core Intel® Xeon®
Processor 5200 Series Thermal/Mechanical Design Guidelines (TMDG) for details on
system thermal solution design, thermal profiles and environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP)
defined in
for the Dual-Core Intel® Xeon® Processor X5200 Series, and
Core Intel® Xeon® Processor L5200 Series and the associated T
point of the thermal profile is the T
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 6-2
Table 6-5
Intel® Xeon® Processor L5200 Series instead of the maximum processor power
consumption. The Thermal Monitor feature is intended to help protect the processor in
the event that an application exceeds the TDP recommendation for a sustained time
period. For more details on this feature, refer to
flexibility for future requirements, systems should be designed to the Flexible
Motherboard (FMB) guidelines, even if a processor with lower power dissipation is
currently planned. Intel® Thermal Monitor 1 and Intel® Thermal Monitor 2
feature must be enabled for the processor to remain within its specifications.
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6-6).With this Thermal Profile, it is expected that the Thermal Control
Table 6-1 for the Dual-Core Intel® Xeon® Processor E5200 Series,
for the Dual-Core Intel® Xeon® Processor E5200 Series,
for the Dual-Core Intel® Xeon® Processor X5200 Series,
Figure 6-2; Table 6-4) is representative of a
Figure 6-2; Table 6-5) is indicative of a constrained
at 0 W power (or no power draw).
CASE_MAX
Section 6.2. To ensure maximum
Thermal Specifications
Figure 6-1;
Figure 6-4).
Table 6-3
Table 6-6 for the Dual-
values. The lower
CASE
Table 6-4 and
for the Dual-Core