Intel E5205 - Cpu Xeon 1.86Ghz Fsb1066Mhz 6M Lga771 Dual Core Tray Datasheet page 29

Dual-Core Intel® Xeon® Processor 5200 Series Electrical Specifications
Table 2-12. Voltage and Current Specifications (Sheet 2 of 2)
Symbol
I
CC_TDC
I
CC_TDC
I
CC_TDC
I
CC_TDC
I
CC_VTT_OUT
I
CC_GTLREF
I
CC_VCCPLL
I
TCC
I
TCC
I
TCC
I
TCC
Notes:
1. Unless otherwise noted, all specifications in this table are based on final silicon characterization data.
2. These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See
3. The voltage specification requirements are measured across the VCC_DIE_SENSE and VSS_DIE_SENSE
lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands with an oscilloscope set to 100 MHz
bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled
in the scope probe.
4. The processor must not be subjected to any static V
particular current. Failure to adhere to this specification can shorten processor lifetime.
5. I
CC_MAX
for details. The processor is capable of drawing I
details on the average processor current draw over various time durations.
6. FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only. See
Section 2.13.1
7. This specification represents the total current for GTLREF_DATA and GTLREF_ADD.
8. V must be provided via a separate voltage source and must not be connected to V
TT
measured at the land.
9. Minimum V
in Figure 6-1
Parameter
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor X5200
Series
Launch - FMB
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor E5200
Series
Launch - FMB
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor L5200
Series
Launch - FMB
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor L5238
Launch - FMB
DC current that may be
drawn from V per land
TT_OUT
I for
CC
GTLREF_DATA and
GTLREF_ADD
I for PLL supply
CC
I for Dual-Core Intel®
CC
Xeon® Processor X5200
Series during active thermal
control circuit (TCC)
I for Dual-Core Intel®
CC
Xeon® Processor E5200
Series during active thermal
control circuit (TCC)
I for Dual-Core Intel®
CC
Xeon® Processor L5200
Series during active thermal
control circuit (TCC)
I for Dual-Core Intel®
CC
Xeon® Processor L5238
during active thermal control
circuit (TCC)
Section 2.5
specification is based on maximum V
for further details on FMB guidelines.
and maximum I are specified at the maximum processor case temperature (TCASE) shown
CC CC
and Figure 6-2.
Min Typ Max
70
60
38
35
580
200
130
90
75
50
42
for more information.
level that exceeds the V
CC
loadline. Refer to Figure 2-5,
CC
for up to 10 ms. Refer to
CC_MAX
Unit Notes 1, 11
A 6,14
A 6,14
A 6,14
A 6,14
mA 16
µA 7
mA 12
A
A
A
A
associated with any
CC_MAX
Figure 2-6, and Figure 2-11
Figure 2-1 for further
. This specification is
CC
29