Table Of Contents - Intel E5205 - Cpu Xeon 1.86Ghz Fsb1066Mhz 6M Lga771 Dual Core Tray Datasheet

Contents
1 Introduction .............................................................................................................. 9
1.1 Terminology ..................................................................................................... 10
1.2 State of Data .................................................................................................... 13
1.3 References ....................................................................................................... 13
2 Dual-Core Intel® Xeon® Processor 5200 Series Electrical Specifications................. 15
2.1 Front Side Bus and GTLREF ................................................................................ 15
2.2 Power and Ground Lands.................................................................................... 15
2.3 Decoupling Guidelines ........................................................................................ 16
2.3.1 VCC Decoupling...................................................................................... 16
2.3.2 VTT Decoupling ...................................................................................... 16
2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 17
2.4.2 PLL Power Supply ................................................................................... 18
2.5 Voltage Identification (VID) ................................................................................ 18
2.6 Reserved, Unused, and Test Signals..................................................................... 21
2.7 Front Side Bus Signal Groups .............................................................................. 22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 24
2.9 Test Access Port (TAP) Connection....................................................................... 24
2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 24
2.10.1 DC Characteristics .................................................................................. 24
2.10.2 Input Device Hysteresis .......................................................................... 25
2.11 Mixing Processors.............................................................................................. 26
2.12 Absolute Maximum and Minimum Ratings ............................................................. 26
2.13 Processor DC Specifications ................................................................................ 27
2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 27
2.13.2 VCC Overshoot Specification .................................................................... 35
2.13.3 Die Voltage Validation ............................................................................. 35
2.14 AGTL+ FSB Specifications................................................................................... 36
3 Mechanical Specifications ........................................................................................ 39
3.1 Package Mechanical Drawings ............................................................................. 39
3.2 Processor Component Keepout Zones................................................................... 43
3.3 Package Loading Specifications ........................................................................... 43
3.4 Package Handling Guidelines............................................................................... 44
3.5 Package Insertion Specifications.......................................................................... 44
3.6 Processor Mass Specifications ............................................................................. 44
3.7 Processor Materials............................................................................................ 44
3.8 Processor Markings............................................................................................ 44
3.9 Processor Land Coordinates ................................................................................ 45
4 Land Listing............................................................................................................. 47
4.1 Dual-Core Intel® Xeon® Processor 5200 Series Pin Assignments ............................ 47
4.1.1 Land Listing by Land Name ...................................................................... 47
4.1.2 Land Listing by Land Number ................................................................... 57
5 Signal Definitions .................................................................................................... 67
5.1 Signal Definitions .............................................................................................. 67
6 Thermal Specifications ............................................................................................ 75
6.1 Package Thermal Specifications ........................................................................... 75
6.1.1 Thermal Specifications ............................................................................ 75
6.1.2 Thermal Metrology ................................................................................. 84
6.2 Processor Thermal Features ................................................................................ 85
Dual-Core Intel® Xeon® Processor 5200 Series Datasheet 3