Intel 5148LV - Xeon Dual Core Active H Datasheet page 4

Data sheet
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6.2.2
On-Demand Mode ...................................................................................84
6.2.3
PROCHOT# Signal ..................................................................................85
6.2.4
FORCEPR# Signal ...................................................................................85
6.2.5
THERMTRIP# Signal ................................................................................86
6.3
Platform Environment Control Interface (PECI) ......................................................86
6.3.1
Introduction ...........................................................................................86
6.3.2
PECI Specifications .................................................................................88
7
Features ....................................................................................................................91
7.1
Power-On Configuration Options ..........................................................................91
7.2
Clock Control and Low Power States .....................................................................91
7.2.1
Normal State .........................................................................................92
7.2.2
HALT or Extended HALT State...................................................................92
7.2.3
Stop-Grant State ....................................................................................94
7.2.4
Stop Grant Snoop State...........................................................................95
7.3
Enhanced Intel SpeedStep® Technology ...............................................................95
8
Boxed Processor Specifications .....................................................................................97
8.1
Introduction ......................................................................................................97
8.2
Mechanical Specifications ....................................................................................99
8.2.1
Boxed Processor Heat Sink Dimensions (CEK).............................................99
8.2.2
Boxed Processor Heat Sink Weight .......................................................... 107
8.2.3
Support (CEK)...................................................................................... 107
8.3
Electrical Requirements .................................................................................... 107
8.3.1
Fan Power Supply (Active CEK)............................................................... 107
8.3.2
Boxed Processor Cooling Requirements.................................................... 108
8.4
Boxed Processor Contents................................................................................. 109
9
Debug Tools Specifications ......................................................................................... 111
9.1
Debug Port System Requirements ...................................................................... 111
9.2
Target System Implementation.......................................................................... 111
9.2.1
System Implementation......................................................................... 111
9.3
Logic Analyzer Interface (LAI) ........................................................................... 111
9.3.1
Mechanical Considerations ..................................................................... 112
9.3.2
Electrical Considerations ........................................................................ 112
Figures
2-1
Input Device Hysteresis ......................................................................................27
2-2
Processor Load Current versus Time .....................................................................31
2-3
2-4
2-5
and Transient Tolerance Load Line .......................................................................33
2-6
Static and Transient Tolerance Load Lines .............................................................34
2-7
VCC Overshoot Example Waveform ......................................................................36
3-1
Processor Package Assembly Sketch.....................................................................37
3-2
Processor Package Drawing (Sheet 1 of 3) ............................................................38
3-3
Processor Package Drawing (Sheet 2 of 3) ............................................................39
3-4
Processor Package Drawing (Sheet 3 of 3) ............................................................40
3-5
Processor Land Coordinates, Top View ..................................................................43
3-6
Processor Land Coordinates, Bottom View .............................................................44
6-1
4
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Processor 5100 Series Thermal Profile ...............................76
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Xeon
Processor 5100 Series
Dual-Core Intel
Datasheet

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