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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is included
with the base enclosure, heat sink, processor, and system board spare part kits.
The following illustration shows the replacement thermal material locations on a computer model
equipped with an AMD processor and a graphics subsystem with discrete memory.
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Thermal paste is used on the processor (1) and the heat sink section (2) that services it.
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A thermal pad is used on the graphics subsystem component (3) and the heat sink section (4) that
services it.
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Chapter 4 Removal and replacement procedures
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