Reliability; Thermal Considerations For Components - Intel D815EGEWLU - P3 Socket 370 MicroATX Motherboard Specification

Table 49 provides maximum case temperatures for D815EGEW board components that are
sensitive to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when considering
proper airflow to cool the D815EGEW board.
Table 49.

Thermal Considerations for Components

Component
Intel Pentium III processor
Intel Celeron processor
Intel 82815G GMCH
Intel 82801BA ICH2
For information about
Intel Pentium III processor datasheets and specification updates
Intel Celeron processor datasheets and specification updates

2.13 Reliability

The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 35 ºC.
D815EGEW board's MTBF: 410,800 hours
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
116 C (under bias)
o
109 C (under bias)
Technical Reference
Refer to
Section 1.2, page 16
Section 1.2, page 16
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