Reliability; Thermal Considerations For Components - Intel BOXDG41AN Technical Product Specification

Intel Desktop Board DG41AN Technical Product Specification
Table 29 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 29. Thermal Considerations for Components
Component
Processor
Intel 82G41 GMCH
Intel 82801GB (ICH7)
For information about
Processor datasheets and specification updates
2.7

Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to
estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Intel Desktop Board
DG41AN MTBF is 355,455 hours.
56
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
102 C (under bias)
o
108 C (under bias)
Refer to
Section 1.2, page 14