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Intel® Desktop Board
DG33FB
Technical Product Specification
®
The Intel
Desktop Board DG33FB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG33FB Specification Update.
May 2007
Order Number: D88105-001US
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Related Manuals for Intel BLKDG33FBC
Summary of Contents for Intel BLKDG33FBC
- Page 1 Order Number: D88105-001US ® The Intel Desktop Board DG33FB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG33FB Specification Update.
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Page 2: Revision History
Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. -
Page 3: Intended Audience
Preface This Technical Product Specification (TPS) specifies the board layout, components, ® connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DG33FB. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG33FB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. - Page 4 Intel Desktop Board DG33FB Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741,824 bits) Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
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Page 5: Table Of Contents
1.4 Processor ..................15 1.5 System Memory ................16 1.5.1 Memory Configurations ............17 ® 1.6 Intel G33 Express Chipset ............... 19 1.6.1 Intel G33 Graphics Subsystem ..........19 ® 1.6.2 Intel Viiv™ Processor Technology .......... 21 1.6.3 USB ................... 21 1.6.4 Serial ATA Interfaces ............ - Page 6 Intel Desktop Board DG33FB Technical Product Specification 2 Technical Reference 2.1 Memory Map................... 37 2.1.1 Addressable Memory............. 37 2.2 Connectors and Headers..............40 2.2.1 Back Panel Connectors ............41 2.2.2 Component-side Connectors and Headers ........ 42 2.3 Jumper Block .................. 50 2.4 Mechanical Considerations ..............
- Page 7 Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance..............75 5.1.1 Safety Standards..............75 5.1.2 European Union Declaration of Conformity Statement ....76 5.1.3 Product Ecology Statements........... 78 5.1.4 EMC Regulations ..............82 5.1.5 Product Certification Markings (Board Level)......84 5.2 Battery Disposal Information.............
- Page 8 Intel Desktop Board DG33FB Technical Product Specification 19. Main Power Connector..............46 20. Front Panel Header ................47 21. States for a One-Color Power LED ............48 22. States for a Two-Color Power LED............48 23. Auxiliary Front Panel Power LED Header..........48 24.
- Page 9 1.2 Legacy Considerations..............15 1.3 Online Support................15 1.4 Processor ..................15 1.5 System Memory ................16 ® 1.6 Intel G33 Express Chipset ............... 19 1.7 Parallel IDE Controller ..............22 1.8 Real-Time Clock Subsystem .............. 22 1.9 Legacy I/O Controller ............... 23 1.10 Audio Subsystem................
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Page 10: Overview
• One IEEE 1394a port • PS/2 keyboard and mouse ports • One serial port header (may require specialized chassis or cable for use) ® LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82566DC Gigabit Ethernet Controller ® • Intel... -
Page 11: Product Description
• Three PCI Express x1 bus add-in card connector • One PCI Express x16 bus add-in card connector ® ® • Intel Quiet System Technology implemented through the Intel Management Hardware Monitor Engine in ICH9DH Subsystem • Voltage sense to detect out of range power supply voltages •... -
Page 12: Board Layout
Intel Desktop Board DG33FB Technical Product Specification 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1. -
Page 13: Board Components Shown In Figure 1
Front chassis fan header BIOS Setup configuration jumper block Auxiliary front panel power LED header Front panel header Serial ATA connectors [4] Parallel ATA IDE connector Front panel USB headers [3] Intel 82801IH I/O Controller Hub (ICH9DH) IEEE 1394a header... -
Page 14: Block Diagram
Intel Desktop Board DG33FB Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2. Block Diagram... -
Page 15: Legacy Considerations
The board is designed to support the following processors: • Intel Core 2 Quad processor in an LGA775 socket with a 1066 MHz system bus • Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus •... -
Page 16: System Memory
Intel Desktop Board DG33FB Technical Product Specification System Memory The board has four DIMM sockets and supports the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported. -
Page 17: Memory Configurations
Product Description 1.5.1 Memory Configurations The Intel 82G33 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. -
Page 18: Memory Channel Configuration And Dimm Configuration
Intel Desktop Board DG33FB Technical Product Specification Figure 3 illustrates the memory channel and DIMM configuration. NOTE The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels are black. Figure 3. Memory Channel Configuration and DIMM Configuration INTEGRATOR’S NOTE... -
Page 19: Intel G33 Express Chipset
Either the Intel Graphics Media Accelerator 3100 (Intel GMA 3100) graphics controller (contained within the 82G33 GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express x16 add-in card is installed, the Intel GMA 3100 graphics controller is disabled. -
Page 20: Configuration Modes
225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is detected, the Intel GMA 3100 graphics controller is enabled and the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be accessed by the ADD2/MEC card. -
Page 21: Intel Viiv™ Processor Technology
This Intel desktop board supports Intel Viiv™ processor technology. To be eligible for the Intel Viiv processor technology brand, a system must meet certain hardware and software requirements. To get the list of requirements for Intel Viiv processor technology branding as well as all the features supported by Intel Viiv processor technology, refer to: http://www.intel.com/products/viiv/index.htm... -
Page 22: Parallel Ide Controller
Intel Desktop Board DG33FB Technical Product Specification Parallel IDE Controller The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer. •... -
Page 23: Legacy I/O Controller
Product Description Legacy I/O Controller The I/O controller provides the following features: • One serial port header • One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for PCI systems •... -
Page 24: 1.10 Audio Subsystem
Back panel – Blue Back panel – Green Back panel – Pink 1.10.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15... -
Page 25: Audio Connectors And Headers
Product Description 1.10.2 Audio Connectors and Headers The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors. -
Page 26: 1.11 Lan Subsystem
Refer to LAN software and drivers http://downloadcenter.intel.com ® 1.11.1 Intel 82566DC Gigabit Ethernet Controller The Intel 82566DC Gigabit Ethernet Controller supports the following features: • PCI Express link • 10/100/1000 IEEE 802.3 compliant • Compliant to IEEE 802.3x flow control support •... -
Page 27: Lan Subsystem Software
Product Description 1.11.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below). -
Page 28: 1.12 Hardware Management Subsystem
Intel Desktop Board DG33FB Technical Product Specification 1.12 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • Fan monitoring and control •... -
Page 29: Thermal Monitoring
Product Description 1.12.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description Auxiliary rear chassis fan Rear chassis fan Thermal diode, located on processor die Thermal diode, located on the GMCH die Processor fan Front chassis fan Thermal diode, located on the ICH9DH die Figure 6. -
Page 30: 1.13 Power Management
Intel Desktop Board DG33FB Technical Product Specification 1.13 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯... -
Page 31: Power States And Targeted System Power
Product Description 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. -
Page 32: Wake-Up Devices And Events
1.13.1.2 ENERGY STAR* In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. Intel has worked directly with these two governmental agencies to define the new requirements. Currently Intel Desktop Boards meet the new requirements. -
Page 33: Hardware Support
Product Description 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. -
Page 34: Fan Headers
Intel Desktop Board DG33FB Technical Product Specification 1.13.2.2 Fan Headers The function/operation of the fan headers is as follows: • The fans are on when the board is in the S0 state. • The fans are off when the board is off or in the S3, S4, or S5 state. -
Page 35: Instantly Available Pc Technology
Product Description 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. -
Page 36: Location Of The Standby Power Indicator Led
Intel Desktop Board DG33FB Technical Product Specification 1.13.2.9 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED. -
Page 37: Technical Reference
GMCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB) • Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express add-in cards • Intel Management Engine support (6 MB) • Base graphics memory support (1 MB or 8 MB) -
Page 38: Detailed System Memory Address Map
Intel Desktop Board DG33FB Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. -
Page 39: System Memory Map
Technical Reference Table 9 lists the system memory map. Table 9. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K... -
Page 40: Connectors And Headers
Intel Desktop Board DG33FB Technical Product Specification Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: Back panel and front panel USB, PS/2, and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. -
Page 41: Back Panel Connectors
Technical Reference 2.2.1 Back Panel Connectors Figure 9 shows the locations of the back panel connectors. Item Description PS/2 mouse port PS/2 keyboard port VGA port IEEE 1394a port USB ports [2] USB ports [2] USB ports [2] Line in Mic in Line out Figure 9. -
Page 42: Component-Side Connectors And Headers
Intel Desktop Board DG33FB Technical Product Specification 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers... -
Page 43: Component-Side Connectors And Headers Shown In Figure 10
Technical Reference Table 10 lists the component-side connectors and headers identified in Figure 10. Table 10. Component-side Connectors and Headers Shown in Figure 10 Item/callout from Figure 10 Description PCI Conventional bus add-in card connector Auxiliary rear chassis fan header PCI Express x1 connector PCI Express x1 connector PCI Conventional bus add-in card connector... -
Page 44: Serial Ata Connectors
Intel Desktop Board DG33FB Technical Product Specification 2.2.2.1 Signal Tables for the Connectors and Headers Table 11. Serial ATA Connectors Signal Name Ground Ground Ground Table 12. Chassis Intrusion Header Signal Name Intruder Ground Table 13. Serial Port Header Signal Name... -
Page 45: Front Panel Audio Header
Technical Reference Table 16. Front Panel Audio Header Signal Name Signal Name [Port 1] Left channel Ground [Port 1] Right channel PRESENCE# (Dongle present) [Port 2] Right channel [Port 1] SENSE_RETURN SENSE_SEND (Jack detection) Key (no pin) [Port 2] Left channel [Port 2] SENSE_RETURN 2.2.2.2 Add-in Card Connectors... -
Page 46: Processor Core Power Connector
Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When... -
Page 47: Connection Diagram For Front Panel Header
Technical Reference 2.2.2.5 Front Panel Header This section describes the functions of the front panel header. Table 20 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 20. Front Panel Header Signal Description Signal... -
Page 48: States For A One-Color Power Led
Intel Desktop Board DG33FB Technical Product Specification 2.2.2.5.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. -
Page 49: Connection Diagram For Front Panel Usb Headers
Technical Reference 2.2.2.7 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES • The +5 V DC power on the front panel USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. -
Page 50: Jumper Block
Intel Desktop Board DG33FB Technical Product Specification Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. -
Page 51: Mechanical Considerations
Technical Reference Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 11.60 inches by 9.60 inches [292 millimeters by 241 millimeters]. -
Page 52: Electrical Considerations
Intel Desktop Board DG33FB Technical Product Specification Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. -
Page 53: Fan Header Current Capability
Technical Reference 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 26 lists the current capability of the fan headers. -
Page 54: Thermal Considerations
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm... -
Page 55: Localized High Temperature Zones
Technical Reference Figure 15 shows the locations of the localized high temperature zones. Item Description Processor voltage regulator area Processor Intel 82G33 GMCH Intel 82801IH (ICH9DH) Figure 15. Localized High Temperature Zones... -
Page 56: Reliability
Intel Desktop Board DG33FB Technical Product Specification Table 27 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. -
Page 57: Environmental
Technical Reference Environmental Table 28 lists the environmental specifications for the board. Table 28. Desktop Board DG33FB Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +70 °C Operating 0 °C to +55 °C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second²... - Page 58 Intel Desktop Board DG33FB Technical Product Specification...
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Page 59: Introduction ................................................................................... 59 3.2 Bios Flash Memory Organization
3.10 BIOS Security Features ..............67 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. -
Page 60: Bios Flash Memory Organization
Intel Desktop Board DG33FB Technical Product Specification Table 29 lists the BIOS Setup program menu features. Table 29. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears Displays Configures Sets Configures Selects boot Saves or passwords and... -
Page 61: Pci Ide Support
Overview of BIOS Features 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. -
Page 62: Legacy Usb Support
Legacy USB support from the BIOS is no longer used. 7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit. To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s... -
Page 63: Bios Updates
For information about Refer to BIOS update utilities http://support.intel.com/support/motherboards/desktop/s b/CS-022312.htm 3.6.1 Language Support The BIOS Setup program and help messages are supported in US English. Additional languages are available in the Integrator’s Toolkit utility. Check the Intel website for details. -
Page 64: Custom Splash Screen
Integrator Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/... -
Page 65: Boot Options
Overview of BIOS Features Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. -
Page 66: Adjusting Boot Speed
It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. -
Page 67: 3.10 Bios Security Features
Overview of BIOS Features 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •... - Page 68 Intel Desktop Board DG33FB Technical Product Specification...
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Page 69: Error Messages And Beep Codes
Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker ..................69 4.2 BIOS Beep Codes ................69 4.3 BIOS Error Messages ............... 69 4.4 Port 80h POST Codes ............... 70 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. -
Page 70: Port 80H Post Codes
Intel Desktop Board DG33FB Technical Product Specification Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. -
Page 71: Port 80H Post Codes
Error Messages and Beep Codes Table 37. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor Cache initialization (including APs) Starting Application processor initialization SMM initialization Chipset Initializing a chipset component Memory... - Page 72 Intel Desktop Board DG33FB Technical Product Specification Table 37. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS/2 or USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only)
- Page 73 Error Messages and Beep Codes Table 37. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called...
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Page 74: Typical Port 80H Post Sequence
Intel Desktop Board DG33FB Technical Product Specification Table 38. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase... -
Page 75: Regulatory Compliance And Battery Disposal Information
Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance..............75 5.2 Battery Disposal Information............. 85 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board DG33FB: • Safety standards • European Union Declaration of Conformity statement •... -
Page 76: European Union Declaration Of Conformity Statement
European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DG33FB is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive). - Page 77 Regulatory Compliance and Battery Disposal Information Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC & 2006/95/EC. Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC.
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Page 78: Product Ecology Statements
请参考 http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der... - Page 79 Regulatory Compliance and Battery Disposal Information Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
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Page 80: Lead Free Desktop Board
Intel Desktop Board DG33FB Technical Product Specification Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını... -
Page 81: Lead-Free Board Markings
Regulatory Compliance and Battery Disposal Information Table 40 shows the various forms of the “Lead-Free 2 Level Interconnect” mark as it appears on the board and accompanying collateral. Table 40. Lead-Free Board Markings Description Mark Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead... -
Page 82: Emc Regulations
Intel Desktop Board DG33FB Technical Product Specification 5.1.4 EMC Regulations Desktop Board DG33FB complies with the EMC regulations stated in Table 41 when correctly installed in a compatible host system. Table 41. EMC Regulations Regulation Title FCC 47 CFR Part 15,... - Page 83 Regulatory Compliance and Battery Disposal Information Japanese Kanji statement translation: this is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference.
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Page 84: Product Certification Markings (Board Level)
China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has... -
Page 85: Battery Disposal Information
Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. - Page 86 Intel Desktop Board DG33FB Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
- Page 87 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
- Page 88 Intel Desktop Board DG33FB Technical Product Specification...