Manual Revision Information; Cooling Solutions - JETWAY 845DBA3A User Manual

M/b for socket 478 pentium 4 processor
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Manual Revision Information

Reversion
Revision History
3.0
Third Edition
Item Checklist
845DBA/845DBAL
Cable for IDE/Floppy
CD for motherboard utilities
Cable for USB Port 3/4 (Option)
845DBA/845DBAL User's Manual
Intel Pentium 4 Processor Family

Cooling Solutions

As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation. The overall goal in providing the proper thermal environment is keeping the
processor below its specified maximum case temperature. Heatsinks induce improved
processor heat dissipation through increased surface area and concentrated airflow
from attached fans. In addition, interface materials allow effective transfers of heat
from the processor to the heatsink. For optimum heat transfer, Intel recommends the
use of thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below
for collection of heatsinks evaluated and recommended by Intel for use with Intel
processors. Note, those heatsinks are recommended for maintaining the specified
Maximum T case requirement. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support Intel processors.
For vendor list of heatsink and fan, please visit :
http://developer.intel.com/design/Pentium4/components/index
Date
July 2002
Chapter 1
1

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