Manual Revision Information - JETWAY 830CF User Manual

Manual Revision Information

Reversion Revision History
5.0 Fifth Edition
Item Checklist
830CN/830CH/830CF Motherboard
Cable for IDE/Floppy
CD for motherboard utilities
Cable for USB Port 3/4 (Option)
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830CN/830CH/830CF User's Manual
AMD Athlon™ / Duron™ Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation. The overall goal in providing the proper thermal environment is keeping the
processor below its specified maximum case temperature. Heatsinks induce improved
processor heat dissipation through increased surface area and concentrated airflow
from attached fans. In addition, interface materials allow effective transfers of heat
from the processor to the heatsink. For optimum heat transfer, AMD recommends the
use of thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below
for collection of heatsinks evaluated and recommended by AMD for use with AMD
processors. Note, those heatsinks are recommended for maintaining the specified
Maximum T case requirement. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support AMD processors.
For vendor list of heatsink and fan, please visit：
http://www1.amd.com/products/duron/thermals
http://www1.amd.com/products/athlon/thermals
Date
November 2001
Chapter 1
2