Thermal Features; Fan Speed Control; Dual Thermal Profile; Fan Speed Control, Tcontrol And Dts Relationship - Intel X5550 - Quad Core Xeon Design Manual

Thermal Solutions
Figure 5-5.

Dual Thermal Profile

Compliance to Profile A ensures that no measurable performance loss will occur due to
TCC activation. It is expected that TCC would only be activated for very brief periods of
time when running a worst-case real world application in a worst-case thermal
condition. A worst-case real world application is a commercially available, useful
application which dissipates power above TDP for a thermally relevant timeframe. One
example of a worst-case thermal condition is when the processor local ambient
temperature is above the y-axis intercept for Profile A.
5.6

Thermal Features

More information regarding processor thermal features is contained in the appropriate
datasheet.
5.6.1

Fan Speed Control

There are many ways to implement fan speed control. Using processor ambient
temperature (in addition to Digital Thermal Sensor) to scale fan speed can improve
acoustics when DTS > T
Table 5-4. Fan Speed Control, T
Condition
DTS T
CONTROL
DTS T
CONTROL
Thermal/Mechanical Design Guide
.
CONTROL
and DTS Relationship
CONTROL
FSC can adjust fan speed to maintain DTS
FSC should adjust fan speed to keep T
specification (increased acoustic region).
FSC Scheme
T (low acoustic region).
CONTROL
at or below the Thermal Profile
CASE
37