Appendix D Case Temperature Reference Metrology; Objective And Scope; Supporting Test Equipment - Intel E6700 - Core 2 Duo Dual-Core Processor Design Manual

Mechanical design guidelines
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Case Temperature Reference Metrology
Appendix D Case Temperature
D.1

Objective and Scope

This appendix defines a reference procedure for attaching a thermocouple to the IHS
of a 775-land LGA package for T
specific features of the 775-land LGA package and of the LGA775 socket for which it is
intended. The recommended equipment for the reference thermocouple installation,
including tools and part numbers are also provided. In addition a video Thermocouple
Attach Using Solder – Video CD-ROM is available that shows the process in real time.
The following supplier can do machining the groove and attaching a thermocouple to
the IHS followed by the reference procedure. The supplier is listed the table below as
a convenience to Intel's general customers and the list may be subject to change
without notice.
Supplier
THERM-X OF
CALIFORNIA
D.2

Supporting Test Equipment

To apply the reference thermocouple attach procedure, it is recommended to use the
equipment (or equivalent) given in the table below.
Item
Microscope
DMM
Thermal Meter
Heater Block
Heater
Transformer
Thermal and Mechanical Design Guidelines
Reference Metrology
measurement. This procedure takes into account the
C
Contact
Phone
Ernesto
510-441-7566
B Valencia
Ext. 242
Measurement and Output
Olympus* Light microscope or equivalent
Digital Multi Meter for resistance measurement
Hand held thermocouple meter
Solder Station (see note 1 for ordering information)
Heater assembly to reflow solder on IHS
WATLOW120V 150W Firerod
Superior Powerstat transformer
Email
ernestov@therm-x.com
Description
Address
1837 Whipple Road,
Hayward, Ca 94544
Part Number
SZ-40
Fluke 79 Series
Multiple Vendors
30330
0212G G1A38-
L12
05F857
83

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