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ATX Thermal/Mechanical Design Information
6.2.4
Heatsink Thermal Validation
Intel recommends evaluation of the heatsink within the specific boundary conditions
based on the methodology described Section 6.3 , and using a thermal test vehicle.
Testing is done on bench top test boards at ambient lab temperature. In particular, for
the reference heatsink, the Plexiglas* barrier is installed 81.28 mm [3.2 in] above the
motherboard (refer to Sections 3.3 and 6.6).
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3σ value for thermal characterization parameter using real processors (based on the
thermal test vehicle correction factors).
Note: The above 81.28 mm obstruction height that is used for testing complies with the
recommended obstruction height of 88.9 mm for the ATX form factor. However, it
would conflict with systems in strict compliance with the ATX specification which
allows an obstruction as low as 76.2 mm above the motherboard surface in Area A.
6.3
Environmental Reliability Testing
6.3.1
Structural Reliability Testing
Structural reliability tests consist of unpackaged, board-level vibration and shock tests
of a given thermal solution in the assembled state. The thermal solution should meet
the specified thermal performance targets after these tests are conducted; however,
the test conditions outlined here may differ from your own system requirements.
6.3.1.1
Random Vibration Test Procedure
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 G RMS
Thermal and Mechanical Design Guidelines
55
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