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Figure 6-1. E18764-001 Reference Design – Exploded View
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease
The ATX motherboard keep-out and the height recommendations defined Section 6.6
remain the same for a thermal solution for the processor in the 775-Land LGA
package.
Note: If this fan design is used in your product and you will deliver it to end use customers,
you have the responsibility to determine an adequate level of protection (such as,
protection barriers, a cage, or an interlock) against contact with the energized fan by
the user during user servicing.
Note: Development vendor information for the reference design is provided in Appendix H.
52
ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines
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