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1. ACCEPTABILITY BASED ON IPC 600G CLASS 2
2. REFER TO BOARD STACK UP FOR THE LATIMATE MATERIAL AND THE
CORRESPONDING THICKNESS AND THE TARGET IMPEDANCE.
3. THE TRANSMISSTION LINE IMPEDANCE SHOULD BE WELL CONTROLLED
THE IMPEDANCE SHALL BE MEASURED WITH TIME DOMAIN REFLECTO-
METER(TDR) EQUIPMENTS, IMPEDANCE REPORT SHOULD BE SUBMIT.
4. PCB E-TEST SHOULD BE DONE ACCORDING TO IPC-D-356 NETLIST
METHOD.
5. TEST ALL BOARDS FOR OPENS AND SHORTS.
6. NO GERBER MODIFICATIONS ALLOWED WITHOUT PRIOR WRITTEN
APPROVAL FROM ARCELIK AS.
4 Layer Stackup
Board total thickness: 63.4 mil +-10% Tolerance
Zdiff@ 90 OHM
Zdiff@100 OHM
Thickness
Dielectric
Solder Mask
Layer
Material
(MIL)
Constant
(MIL)
9 mil/5 mil
7 mil/5 mil
1.4
90ohm+-10%
100ohm+-10%
1
Copper
N/A
MIN 0.4
FR4
9
4.3
N/A
N/A
N/A
2
Copper
1.4
N/A
N/A
N/A
N/A
FR4
4.3
N/A
N/A
N/A
39
3
Copper
1.4
N/A
N/A
N/A
N/A
FR4
9
4.3
N/A
N/A
N/A
4
Copper
1.4
N/A
MIN 0.4
9 mil/5 mil
7 mil/5 mil
3.2x1+-0.1mm
R964
R977
R100
R539
1.5mmx2.6mm +-0.1mm
R502
D925
R300
R303
1
R301
C310
R501
L302
C308
R966
C309
C306
1.5mmx2.6mm +-0.1mm
R305
R961
L300
L301
R302
L402
1.5mmx2.6mm +-0.1mm
L408
C468
3.2x1+-0.1mm
C307
C313
1.5mmx2.6mm +-0.1mm
1
1.5mmx2.6mm +-0.1mm
R384
R383
R381
1
R703
R667
R666
R965
R416
1.5mmx2.6mm +-0.1mm
R704
R362
R430
R405
R968
R359
R356
1
R352
R967
R450
R345
T400
T402
R332
C403
R429
R423
L617
R404
C401
1
2.5mm x 4mm +-0.076mm
1
L606
R605
1
1
T401
R722
R721
R709
R708
C704
T706
D717
1
1
L612
1
LABEL2
R440
R103
R102
R442
RP405
B1
RP408
1
R323
R119
R114
RP402
RP406
R437
RP400
R325
RP401
R321
2.5mm x 4mm +-0.076mm
RP407
C682
R105
R104
RP404
C685
R673
R671
RP403
C686
C687
R670
R446
R675
C681
R669
C684
R674
R447
R672
R436
C683
1
L618
THIS DRAWING CONTAINS
THIS DRAWING CONTAINS
INFORMATION WHICH IS THE
INFORMATION WHICH IS THE
PROJECT NAME
PROJECT NAME
TP PROJECT
TP PROJECT
PROPRIETARY PROPERTY OF
PROPRIETARY PROPERTY OF
ARCELIK A.S.
ARCELIK A.S.
THIS DRAWING IS RECEIVED
THIS DRAWING IS RECEIVED
PCB CODE
PCB CODE
VSF190R-4
VSF190R-4
IN CONFIDENCE AND ITS
IN CONFIDENCE AND ITS
CONTENTS MAY NOT BE
CONTENTS MAY NOT BE
DISCLOSED WITHOUT THE
DISCLOSED WITHOUT THE
LAYER INFO
LAYER INFO
PRIOR WRITTEN CONSENT OF
PRIOR WRITTEN CONSENT OF
TOP OVERLAY
TOP SOLDER
ARCELIK A.S.
ARCELIK A.S.
Description
Microstrip
Pre-preg
GND Plane
Core
VCC Plane
Pre-preg
Microstrip
R963
R616
R618
T600
R920
R611
D919
R962
R950
R948
R947
R643
1
R716
1
D720
R711
R717
L608
D702
R712
D712
D707
R113
T700
T704
T705
D100
R306
1
R500
C312
R324
1
L610
C115
C311
1
C114
R351
R668
R326
R115
R660
T604
R867
1
2
RP824
RP823
RP822
RP821
RP820 RP819
39
40
1
R815
R821
R852
R853
R878
RP800
RP801
RP802
RP803
RP804
RP805
1
R879
RP806
1
R877
R876
RP807
RP808
1
R855
R858
RP813
RP809
RP814
RP810
RP815
RP816
RP811
R874
RP817
R875
R109
RP818
R837
R840
R864
39
R112
R834
L601
RP812
R823
R827
R828
R824
R839
1
1
IC804
R826
1
3
TOP VIEW !
TOP VIEW !
27.07.2011
27.07.2011
ARCELIK A.S.
ARCELIK A.S.
D607
1x5.5mm+-0.076mm
1x3.5mm+-0.076mm
2
40
R658
R650
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