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4. PRE-MONITORING SETTINGS, INSTALLATION, AND SET-UP
MELSEC-A
4.3
Loading and Installation
This section explains the loading instructions and installation environment so
that the unit will function correctly.
4.3.1
Handling precautions
Take the following precautions when handling the AD57G.
(1) Since the case is made of plastic, do not drop it or subject it to mechani-
cal shock.
(2)
Do not remove the printed circuit board of any module from its case.
(3)
When wiring, make every effort to prevent wire offcuts from getting into
the module.
(4) Tighten the module mounting screws as indicated below (this procedure
is normally not necessary).
•
Screw
Tightening Torque N·cm [kg·em]
[lb-lnch)
Module fixing screws (optional) (M4 x 0.7)
78 [8](6.93) to 118 [12](10.39)
(5) To connect the AD57G to the base, press the AD57G against the base
so that the latch is securely locked. To disconnect the AD57G, push the
latch.
After the latch is disengaged from the base, pull the AD57G
toward you.
(The User's Manual of each ACPU gives details.)
4.3.2
Installation environment
Never install the system in the following environments:
(1)
Locations where the ambient temperature is outside the range of 0 to 55°C.
(2)
Locations where the ambient humidity is outside the range of 10 to 90%RH.
(3)
Locations where dew condensation takes place due to sudden tempera-
ture changes.
(4)
Locations where there are corrosive and/or combustible gasses.
(5)
Locations where there is a high level of conductive powder (dust, iron
filings, oil mist, salt, organic solvent, etc.).
(6)
Locations exposed to the direct rays of the sun.
(7)
Locations where strong power and magnetic fields are generated.
(8)
Locations where vibration and shock can be directly transmitted to the
main unit.
4-5
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