Dev-Rf002 Module Block Diagram; Rf Section; Figure 1-4 Dev-Rf002 Functional Block Diagram - Texas Instruments DEV-RF002 Datasheet

Table of Contents

Advertisement

1.1 DEV-RF002 Module Block Diagram

The diagram below provides an overview of the DEV-RF002's interconnect.

2 RF Section

2.1 CC2650
The DEV-RF002 utilizes the Texas Instruments CC2650 to provide BLE connectivity. The CC2650 is a flexible
wireless MCU that can be configured to provide various connectivity standards and includes numerous
peripherals. The flexibility of the CC2650 allows it to be configured in many ways with respect to the RF
interface, connectivity protocol, clocks, and power supplies. The default DEV-RF002 connectivity protocol is
Bluetooth SMART. The protocol stack is stored internally in the CC2650 and is executed by a dedicated on-chip
ARM Cortex®-M0 processor.
The two primary clocks for the CC2650 are provided by on board 24 MHz and 32.768 KHz crystals. While this
configuration does not utilize any loading capacitors on the 24 MHz oscillator, the board design includes them to
allow the use of different crystals as long as they have the same package.
The supply voltage configuration for the CC2650 utilizes the internal DC-DC converter. The 3.3VDC power rail
from the P1 header is filtered and powers the three VDDS pins on the CC2650 along with the VDDS_DCDC pin.
The output of the internal DC-DC converter is filtered and used to power the VDDR and VDDR_RF pins of the
CC2650.
The CC2650 RF output pins (RF_P and RF_N) are combined into a single ended RF signal in a LC balun
network before being routed to a Taiyo Yuden AH316M245001 chip antenna.
P1 & P2 Headers
SPI Interface
I2C Interface
GPIO [9..0]
SPI Interface
UART Interface
Optional
BBB
SFLASH

Figure 1-4 DEV-RF002 functional block diagram

CC2650
Multistandard
(BLE SMART)
Wireless MCU
RF Switch
CC3100
WiFi Network
Processor
8 Mbit
SFlash
7
Chip Antenna
Optional
Chip Antenna

Advertisement

Table of Contents
loading

Table of Contents