Samsung P560 Service Manual page 373

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6. Material List
Location SEC CODE
EC15 2402-001042 C-AL,SMD
EC16 2402-001042 C-AL,SMD
R298 2007-001292 R-CHIP
R299 2007-001292 R-CHIP
R300 2007-001292 R-CHIP
R377 2007-001292 R-CHIP
R378 2007-001292 R-CHIP
R380 2007-001292 R-CHIP
R427 2007-001292 R-CHIP
R413 2007-000157 R-CHIP
R404 2007-007642 R-CHIP
R504 2007-007642 R-CHIP
R527 2007-007642 R-CHIP
SUB MATERIAL BA99-07565A ASSY SUB/MATERIAL-NP_SMT
0.6 SMT 0202-001499 SOLDER-WIRE FLUX
SOLDER CREAM 0202-001461 SOLDER-CREAM
METAL MASK SOLVENT 0204-000199 SOLVENT
ABLE BOND 0201-001002 ADHESIVE-TS
PART ADHESIVE 0201-000160 ADHESIVE-TS
SOLDER CREAM 0202-001520 SOLDER-CREAM
ART PAPER BA68-40012N LABEL-LOCATION
MICOM LABEL BA68-40012N LABEL-LOCATION
SMT LABEL BA68-40012N LABEL-LOCATION
EC22 2402-001168 C-POLYMER AL CHIP
EC7 2402-001168 C-POLYMER AL CHIP
Q21 0505-001352 FET-SILICON
Q22 0505-001352 FET-SILICON
Q1 0505-002169 FET-SILICON
Q7 0505-002169 FET-SILICON
MICOM BA46-08309A S/W MICOM
R319 2007-008429 R-CHIP
R536 2007-008429 R-CHIP
R525 2007-007942 R-CHIP
R520 2007-008007 R-CHIP
R519 2007-008400 R-CHIP
R316 2007-007226 R-CHIP
R498 2007-007226 R-CHIP
R506 2007-007226 R-CHIP
R376 2007-002425 R-CHIP
R349 2007-007697 R-CHIP
R321 2007-008359 R-CHIP
C31 2203-006336 C-CER,CHIP
C32 2203-006336 C-CER,CHIP
C55 2203-000489 C-CER,CHIP
D12 0404-001382 DIODE-SCHOTTKY
D14 0404-001020 DIODE-SCHOTTKY
J11 3709-001401 CONNECTOR-CARD EDGE
SMT_D BA92-05018D ASSY MOTHER BD-SMT_D
B601 3301-001649 BEAD-SMD
B602 3301-001649 BEAD-SMD
B605 3301-001649 BEAD-SMD
B606 3301-001649 BEAD-SMD
B607 3301-001649 BEAD-SMD
Main System
NAME
100uF,20%,16V,GP,TP,6.6x6.6x5.4mm
100uF,20%,16V,GP,TP,6.6x6.6x5.4mm
33ohm,5%,1/16W,TP,1005
33ohm,5%,1/16W,TP,1005
33ohm,5%,1/16W,TP,1005
33ohm,5%,1/16W,TP,1005
33ohm,5%,1/16W,TP,1005
33ohm,5%,1/16W,TP,1005
33ohm,5%,1/16W,TP,1005
47Kohm,5%,1/16W,TP,1005
12.1ohm,1%,1/16W,TP,1005
12.1ohm,1%,1/16W,TP,1005
12.1ohm,1%,1/16W,TP,1005
N/P,SMT SUB/MATERIAL,RIBBON,SOLVENT,BOND,-
SR34 SUPER LFM-48,-,D0.6,96.5Sn/3Ag/0.5Cu,Flux_3.5%
NP303-LD155-GQ,-,D38~10UM,96.5SN/3AG/0.5CU,FLUX
SUPANUKE-20,I.P.A,98%,-
8380,SIL,9000CPS,10cc
D520,NTR,-
LFM-48X TM-HP,-,D25-45um,96.5Sn/3Ag/0.5Cu,Flux 12.0%
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
330uF,20%,2.5V,WT,TP,7.3*4.3*1.8mm,-
330uF,20%,2.5V,WT,TP,7.3*4.3*1.8mm,-
Si4894BDY,N,30V,8.9A,0.011ohm,1.4W,SO-8
Si4894BDY,N,30V,8.9A,0.011ohm,1.4W,SO-8
Si4435BDY-T1-E3,P,-30V,-9.1A,0.035ohm,2.5W,SO-8
Si4435BDY-T1-E3,P,-30V,-9.1A,0.035ohm,2.5W,SO-8
OXFORD,-,SYSTEM,ALL,00LU,-,-
499ohm,1%,1/16W,TP,1005
499ohm,1%,1/16W,TP,1005
1Mohm,1%,1/16W,TP,1005
3.24Kohm,1%,1/10W,TP,1608
453ohm,1%,1/10W,TP,1608
49.9ohm,1%,1/10W,TP,1608
49.9ohm,1%,1/10W,TP,1608
49.9ohm,1%,1/10W,TP,1608
1ohm,5%,1/10W,TP,1608
2.4Kohm,1%,1/16W,TP,1005
3.01Kohm,1%,1/16W,TP,1005
10000nF,10%,25V,X5R,3216
10000nF,10%,25V,X5R,3216
2.2nF,10%,50V,X7R,1005
CRS06,20V,1000mA,3-2A1A,TP
BAT54C,30V,200mA,SOT-23,TP
52P,0.8mm,SMD-A,AU,mini pci express
OXFORD,PGA,DDR3,3MB/
180ohm,1608,-,TP,-,226ohm/389MHz,-
180ohm,1608,-,TP,-,226ohm/389MHz,-
180ohm,1608,-,TP,-,226ohm/389MHz,-
180ohm,1608,-,TP,-,226ohm/389MHz,-
180ohm,1608,-,TP,-,226ohm/389MHz,-
6-187
Description Qt'y SA/SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
4 SNA
SNA
SNA
SNA
4 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA