Samsung P560 Service Manual page 351

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6. Material List
Location SEC CODE
R122 2007-007306 R-CHIP
R123 2007-007306 R-CHIP
R124 2007-007306 R-CHIP
R214 2007-007306 R-CHIP
R271 2007-007306 R-CHIP
R440 2007-007306 R-CHIP
R484 2007-007306 R-CHIP
R511 2007-007306 R-CHIP
R95 2007-007306 R-CHIP
R100 2007-007489 R-CHIP
C517 2203-006166 C-CER,CHIP
C126 2203-006348 C-CER,CHIP
C127 2203-006348 C-CER,CHIP
C128 2203-006348 C-CER,CHIP
C129 2203-006348 C-CER,CHIP
C132 2203-006348 C-CER,CHIP
C133 2203-006348 C-CER,CHIP
C134 2203-006348 C-CER,CHIP
C135 2203-006348 C-CER,CHIP
C43 2203-006348 C-CER,CHIP
C44 2203-006348 C-CER,CHIP
C454 2203-006348 C-CER,CHIP
C455 2203-006348 C-CER,CHIP
C47 2203-006348 C-CER,CHIP
C516 2203-006348 C-CER,CHIP
C77 2203-006348 C-CER,CHIP
C20 2203-000940 C-CER,CHIP
C511 2203-000940 C-CER,CHIP
C512 2203-000940 C-CER,CHIP
C53 2203-000940 C-CER,CHIP
C54 2203-000940 C-CER,CHIP
C509 2203-002487 C-CER,CHIP
C471 2203-001405 C-CER,CHIP
C472 2203-001405 C-CER,CHIP
C466 2203-002050 C-CER,CHIP
C85 2203-002050 C-CER,CHIP
C443 2203-000425 C-CER,CHIP
C445 2203-000425 C-CER,CHIP
U19 0801-002478 IC-CMOS LOGIC
U18 1203-002364 IC-RESET
U16 1203-004685 IC-PWM CONTROLLER
U15 BA09-00009A IC MICOM
SUB MATERIAL BA99-07565A ASSY SUB/MATERIAL-NP_SMT
0.6 SMT 0202-001499 SOLDER-WIRE FLUX
SOLDER CREAM 0202-001461 SOLDER-CREAM
METAL MASK SOLVENT 0204-000199 SOLVENT
ABLE BOND 0201-001002 ADHESIVE-TS
PART ADHESIVE 0201-000160 ADHESIVE-TS
SOLDER CREAM 0202-001520 SOLDER-CREAM
ART PAPER BA68-40012N LABEL-LOCATION
MICOM LABEL BA68-40012N LABEL-LOCATION
SMT LABEL BA68-40012N LABEL-LOCATION
Main System
NAME
100ohm,1%,1/16W,TP,1005
100ohm,1%,1/16W,TP,1005
100ohm,1%,1/16W,TP,1005
100ohm,1%,1/16W,TP,1005
100ohm,1%,1/16W,TP,1005
100ohm,1%,1/16W,TP,1005
100ohm,1%,1/16W,TP,1005
100ohm,1%,1/16W,TP,1005
100ohm,1%,1/16W,TP,1005
150Kohm,1%,1/16W,TP,1005
100nF,10%,25V,X5R,1005
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
1000nF,10%,25V,X5R,1608
0.47nF,10%,50V,X7R,1005
0.47nF,10%,50V,X7R,1005
0.47nF,10%,50V,X7R,1005
0.47nF,10%,50V,X7R,1005
0.47nF,10%,50V,X7R,1005
4.7nF,10%,25V,X7R,1005
22nF,+80-20%,25V,Y5V,1005
22nF,+80-20%,25V,Y5V,1005
47nF,10%,50V,X7R,1608
47nF,10%,50V,X7R,1608
0.018nF,5%,50V,C0G,1005
0.018nF,5%,50V,C0G,1005
7SZ14,SCHMITT TRIGGER,SOT-23,5P,63MIL,SINGLE,TR,-
TPS3809L30DBVR,SOT-
SC415,MLPQ,24P,4x4mm,PLASTIC,0.75/5V,-,-40to+85C,-,-
H8S/2111B,-,-,-,-,-,-,-,-,TQFP,-,18*18MM,-,-20TO75
N/P,SMT SUB/MATERIAL,RIBBON,SOLVENT,BOND,-
SR34 SUPER LFM-48,-,D0.6,96.5Sn/3Ag/0.5Cu,Flux_3.5%
NP303-LD155-GQ,-,D38~10UM,96.5SN/3AG/0.5CU,FLUX
SUPANUKE-20,I.P.A,98%,-
8380,SIL,9000CPS,10cc
D520,NTR,-
LFM-48X TM-HP,-,D25-45um,96.5Sn/3Ag/0.5Cu,Flux 12.0%
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
6-165
Description Qt'y SA/SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SNA
1 SA
1 SNA
1 SNA
1 SNA
4 SNA
SNA
SNA
SNA
4 SNA
1 SNA
1 SNA
1 SNA