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4.
Remove the heat sink (2).
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink, processor, and system board spare part kits.
The following illustration shows the replacement thermal material locations on a computer model
equipped with a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
Component replacement procedures
117
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