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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
LYB10223-001D
C3009
R3002
R3003
R3082
R302
R3008
IC3003
S101
CN211
No.YF335
C3026
X3001
R1117
R1030
R1009
R1025
R1008
R1017
R3023
C3052
TP7
C7801
L3703
C7802
C3710
(No.YF335<Rev.001>)19/30
<MAIN CIRCUIT BOARD>
<01>MAIN
LYB10223-001D
R185 R184
C1003
R1054
C1020
R1077
RA1003
R1079
R1098
R1080
C6005
R1092
R6004
C6002
C1014
C1032
C1012
C1033
C1030
C1035
created date:2010-02-19
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