Sony Ericsson W960 Working Instruction, Electrical page 9

4. Process instruction
4.1 Needed equipment and tools
• BGA rework station
• Adequate Reflow profile for component
• Adequate Nozzle
• Soldering iron
• Hot air station
• Tweezers
• De-soldering wick
• Flux
4.2 Process description
BGA rework station is using to solder and de solder PoP component. Be sure that correct
soldering head (Nozzle) and correct temperature profile is used.
Soldering iron, hot air station, flux and de-soldering wick are used to remove the soldering
rest of the PCB after the old component has been removed.
5. Work instruction
5.1 Removing
This instruction is showing how to remove the PoP component in one heating cycle.
Equipment used A: Finetech CRS 10, Fine placer.
B: OKI, BGA station
Other similar BGA station can be use.
5.1A
Put the board in the fixture, chose the right nozzle and temperature profile.
Align the nozzle to the component and start the de-soldering program.
When the temperature is coming to the melting point activate the vacuum, the memory
will be removed from the CPU (picture A1), lift the nozzle for a few centimeters and
remove the memory from the nozzle using tweezers (picture A2). Put the nozzle down
again, readjust the distance to the CPU, and wait for a couple of seconds and remove the
CPU component too (picture A3). Wait for the cooling down time, and remove the PCB
from the fixture and go to next step.
Picture A1
1206-4806 Rev1
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Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
Picture A2
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