Pop Components Repair Instruction - Sony Ericsson W960 Working Instruction, Electrical

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PoP Components Repair instruction

1. Scope of the work instruction
2. Description
3. Preparation
4. Process instruction
4.1 Needed equipment and tools
4.2 Process description
5. Work instruction
5.1 Removing
5.2 Soldering removal
5.3 Inspection
5.4 Assembly and re soldering
5.5 Inspection after repair
6. Revision History
1. Scope of the work instruction
This document was created to help and guide the repair operators to replace the PoP
components and to avoid mistakes and misunderstandings during the repair process and to
avoid any damage to the final product.
2. Description
PoP component is a new type of BGA component which is made by two components,
CPU on bottom and Memory soldered directly on the top of CPU, see picture below.
Fig 1: Cross-sectional view of the PoP stack.
Bottom package: CPU( Suzi/ Anja).
Top package: Memory NAND/SDRAM
Example of PoP components used in P1i is D2500, the PDA processor with memory.
3. Preparation
Before starting the repair action, be sure that:
• You have trained to use BGA rework station
• You have the necessary tools
• You have correct components (type and revision)
• You are ESD protected
1206-4806 Rev1
©
Sony Ericsson Mobile Communications AB
PoP component (Package-on-Package).
Working Instruction, Electrical
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