Package List - Toshiba TLCS-900 Family Product Manual

Package List

Microcomputer package summary
To meet customers' needs Toshiba provides a wide range of highly reliable packages for high-density mounting. In
particular, Toshiba's miniature packages for portable applications offer extensive choices ranging to products as
compact as 144-pin and 0.4-mm pitch.
SDIP/SOP/SSOP/QFP/FBGA packages for 4-/8-/16-/32-bit microcontrollers
Size
The number above each photograph (actual size) indicates the pin pitch (mm).
(mm)
FBGA
SDIP20 SDIP32
15 15
QFP
28 28
LQFP
20 20
LQFP
16 16
QFP
14 20
TQFP/LQFP/
QFP
14 14
LQFP
12 12
LQFP
10 10
LQFP
7 7
SSOP-300
10 6
SOP-450
18 8
1.27
SOP-300
13 5
1.27
SOP-300
10 5
16 20
64
0.8
0.8
0.5
0.65
1.27
28 30 44 48
1.0 0.8
0.65
0.8
0.5
0.5
0.5
64 80 100
0.65
(Top)
0.5
0.4
0.4
Package pin pitch table
Package Pin Pitch Number of pins
64
1.0mm
44 64 80
0.8mm
QFP
100
0.65mm
100
0.5mm
44
0.8mm
48 64 80 100
0.5mm
LQFP
0.4mm
100
0.5mm
TQFP
128
0.4mm
128 144 160 228
FBGA
15
(Bottom)
QFP
28 28
LQFP
20 20
LQFP
16 16
QFP
14 20
TQFP/LQFP/
QFP
14 14
LQFP
12 12
LQFP
10 10
LQFP
7 7
160
SSOP-300
10 6
144
SOP-450
18 8
144
SOP-300
13 5
SOP-300
10 5
Number
of pins
65