Siemens SIMATIC CPU 410 System Manual page 392

Process control system, process automation/cpu
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Connection examples for redundant I/Os
C.2 Interconnection of output modules
Information on connecting digital output modules via diodes
● Suitable diodes are diodes with U
1N4003 ... 1N4007).
● It is advisable to separate the ground of the module and the ground of the load. There
must be equipotential bonding between both.
Information on connecting analog output modules via diodes
● Suitable diodes are diodes with U
1N4003 ... 1N4007).
● A separate load supply is advisable. There must be equipotential bonding between both
load supplies.
392
>=200 V and I_
>= 1 A (e.g., types from the series
_r
F
>=200 V and I_
>= 1 A (e.g., types from the series
_r
F
CPU 410 Process Automation/CPU 410 SMART
System Manual, 05/2017, A5E31622160-AC

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