Thermal Management; Figure 49. Air Flow And Fan Identification; Table 66. Air Flow - Intel S2600KPFR Product Specifications

Thermal Management

10 Thermal Management
The compute module is designed to operate at external ambient temperatures of between
10ºC and 35ºC with limited excursion based operation up to 45ºC. Working with integrated
platform management, several features within the compute module are designed to move air
in a front-to-back direction, through the compute module and over critical components to
prevent them from overheating and allow the system to operate with best performance.
The following table provides air flow data associated with the different product models within
this product family, and is provided for reference purposes only. The data was derived from
actual wind tunnel test methods and measurements using fully configured system
configurations. Lesser system configurations may produce slightly different data results. As
such, the CFM data provided using server management utilities that utilize platform sensor
data, may vary from the data listed in the table.
With Intel
With Intel
The compute module supports short-term, excursion-based, operation up to 45°C (ASHRAE
A4) with limited performance impact. The configuration requirements and limitations are
described in the configuration matrix found in the Power Budget and Thermal Configuration
Tool, available as a download online at http://www.intel.com/support.
134

Figure 49. Air Flow and Fan Identification

Table 66. Air Flow

® Server Chassis H2312XXKR2/LR2
®
Server Chassis H2216XXKR2/LR2
Technical Product Specification
Single Compute Module Airflow
6 ~ 30CFM
5 ~ 41CFM
Revision 1.37