Intel S2600KPFR Product Specifications page 118

Platform Management
DIMM temperature monitoring: New sensors and improved acoustic management

using closed-loop fan control algorithm taking into account DIMM temperature
readings.
Address Resolution Protocol (ARP): The BMC sends and responds to ARPs (supported

on embedded NICs).
Dynamic Host Configuration Protocol (DHCP): The BMC performs DHCP (supported on

embedded NICs).
Platform environment control interface (PECI) thermal management support

E-mail alerting

Support for embedded web server UI in Basic Manageability feature set.

Enhancements to embedded web server

o Human-readable SEL
o Additional system configurability
o Additional system monitoring capability
o Enhanced on-line help
Integrated KVM.

Enhancements to KVM redirection

o Support for higher resolution
Integrated Remote Media Redirection

Lightweight Directory Access Protocol (LDAP) support

Intel ® Intelligent Power Node Manager support

Embedded platform debug feature which allows capture of detailed data for later

analysis.
Provisioning and inventory enhancements:

o Inventory data/system information export (partial SMBIOS table)
DCMI 1.5 compliance (product-specific).

Management support for PMBus* rev1.2 compliant power supplies

BMC Data Repository (Managed Data Region Feature)

Support for an Intel® Local Control Display Panel

System Airflow Monitoring

Exit Air Temperature Monitoring

Ethernet Controller Thermal Monitoring

Global Aggregate Temperature Margin Sensor

Memory Thermal Management

Power Supply Fan Sensors

Energy Star Server Support

Smart Ride Through (SmaRT)/ Closed Loop System Throttling (CLST)

102
Technical Product Specification
Revision 1.37