Intel JBOD 2000 Hardware Manual page 16

Product Family Overview
Parameter
Line to earth
Only
ESD
Air Discharged
Contact
Discharge
Acoustics
Sound Power
Measured
Power in Watts
Servers/Rack
Mount BA
Note:
1. Intel Corporation server boards contain a number of high-density VLSI and power delivery components
that need adequate airflow to cool. Intel ensures through its own chassis development and testing that
when Intel server building blocks are used together, the fully integrated system will meet the intended
thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
6
Intel® Storage Server System JBOD 2000 Family Hardware Guide
AC Leads 2.0 kV
I/O Leads 1.0 kV
DC Leads 0.5 kV
12.0 kV
8.0 kV
<300 W ≥300 W ≥600 W
7.0 7.0
Limits
≥1000 W
7.0 7.0
Revision 1.42