Data Carriers; Section 6 Chemical Resistance - Omron V600-HAM42-DRT Operation Manual

Data Carriers

6-2 Data Carriers
V600-D23P61, V600-D23P53, and V600-D23P54 EEPROM Data Carriers
V600-D8KR12, V600-D8KR13, and V600-D8KR04 SRAM Data Carriers
Chemicals that Cause Deformation, Cracks, etc.
ABS resin
Trichlene, acetone, xylene, toluene, gasoline, creosol,
methylene chloride, phenol, cyclohexane, aqua regia,
chromic acid, sulfuric acid (90% RT), methyl ethyl ketone,
aniline, nitrobenzine, monochlorobenzine, pyridine, nitric
acid (60% RT), formic acid (80% RT)
Chemicals that may Cause Discoloration, Swelling, etc.
ABS resin
Hydrochloric acid, alcohol, Freon, sodium hydroxide,
hydrogen peroxide, benzine, sulfuric acid (10% RT), nitric
acid (10% RT), phosphoric acid (80% RT), ammonia
solution
Chemicals that Do Not Affect ABS Resin or Epoxy Resin
ABS resin
Ammonia, kerosine, mineral oil, developer, Yushiroken
S50, Chemi-Cool Z, Velocity No. 3, Yushiroken EEE-30Y,
petroleum, grease acetate, calcium hydroxide, phosphoric
acid (30% RT), hydrochloric acid (10% RT), potassium
hydroxide
Caution
!
Note The information on chemical resistance and extracted substances presented in
this section must be used for reference purposes only. The change rates of Data
Carrier characteristics and the amounts of substances extracted vary with tem-
peratures and chemical concentrations. Therefore, before using the Data Carri-
er in an actual production environment, always conduct tests to check for any
problems.
ABS resin is used as casing material and epoxy resin is used as filler resin. Avoid
using chemicals that may affect ABS resin and epoxy resin by referring to the
following tables.
Note Tests for these chemicals were conducted at room temperature 23_C. The
chemicals that do not affect ABS or epoxy resin at room temperature 23_C may
affect them at higher or lower temperatures. Therefore, carefully examine the
effects of these chemicals on ABS and epoxy resin beforehand.
The V600-D23P71/P72 Data Carriers have no chemical and oil resistance. Do
not use them in places exposed to spattering from chemicals and oil.
Epoxy resin
Aqua regia, chromic acid, sulfuric acid (90% RT), nitric
acid (60% RT), ammonia solution, acetone, methylene
chloride, phenol
Epoxy resin
Sulfuric acid (10% RT), nitric acid (10% RT), hydrochloric
acid (30% RT), acetic acid (50% RT), calcium hydroxide,
benzine, creosol, alcohol, cyclohexane, toluene, xylene,
benzine, grease
Epoxy resin
Ammonia, hydrochloric acid (10% RT), potassium
hydroxide, petroleum, gasoline, Yushiroken S50,
Chemi-Cool Z, Velocity No. 3, Yushiroken EEE-30Y
Section 6-2
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