EN 18
4.
Dismantling the Power secondary Board
• Dismantle MDM- and ASP Board (as described before) first.
• Unplug headphone cable from ASP Board and put it out from the
catches on the Power secondary support frame.
• Release all cables on top → see picture 17
• Release cable to Amplifier Board from the catches on the rear
side of the support frame.
• Remove contact springs and cable ties as shown in picture 18 and
give cables a proper free length for dismantling.
• Remove 3 screws as shown in picture 19
• Raise the board up and put it to a desired service position → see
picture 20
picture 17
cable ties
picture 18
picture 19
LX9000R
Dismantling Instructions
move out all wires
picture 20
Dismantling the support frame of the Power secondary Board
• Dismantle the Power secondary Board as described before.
• Loosen 2 screws from the component side of the board.
• Release 3 catches as shown in picture 21.
• Turn the released part of the support frame away as shown in
picture 22.
The printed circuit board will now automaticly be released on the
rear edges and can be taken off.
picture 21
picture 22