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How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
CBA
Masking
Tape
Tweezers
With Soldering Iron:
1. Using desoldering braid, remove the solder from
2. Lift each lead of the flat pack-IC upward one by
Fig. S-1-1
3. Bottom of the flat pack-IC is fixed with glue to the
4. Release the flat pack-IC from the CBA using
With Iron Wire:
1. Using desoldering braid, remove the solder from
2. Affix the wire to a workbench or solid mounting
Hot-air
Flat Pack-IC
Desoldering
3. While heating the pins using a fine tip soldering
Machine
4. Bottom of the flat pack-IC is fixed with glue to the
Flat Pack-IC
5. Release the flat pack-IC from the CBA using
Fig. S-1-2
Note: When using a soldering iron, care must be
1-3-3
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
Desoldering Braid
Flat Pack-IC
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Fine Tip
Soldering Iron
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
tweezers. (Fig. S-1-6)
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
point, as shown in Fig. S-1-5.
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
tweezers. (Fig. S-1-6)
taken to ensure that the flat pack-IC is not
Soldering Iron
Fig. S-1-3
Sharp
Pin
Fig. S-1-4
TVVCRP_SN
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