Durabrand T6609BK Service Manual page 10

Replacement Procedures for
Leadless (Chip) Components
The Following Procedures are
Recommended for the Replacement of the
Leadless Components Used in this Unit.
1. Preparation for replacement
1-1. Pb free solder
a. Soldering Iron
Use a soldering iron for Pb free solder.
b. Solder
Be sure to use Pb free solder.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before
installation. (130 °C ~ 150 °C, for about two
minutes.)
1-2. Standard solder
a. Soldering Iron
Use a pencil-type soldering iron (less than 30
watts).
b. Solder
Eutectic solder (Tin 63%, Lead 37%) is
recommended.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before
installation. (130 °C ~ 150 °C, for about two
minutes.)
Note:
a. Leadless components must not be reused after
removal.
b. Excessive mechanical stress and rubbing for
the component electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers
and alternately apply heat to both electrodes. When
the solder on both electrodes has melted, remove
leadless component with a twisting motion.
Note:
a. Do not attempt to lift the component off the
board until the component is completely
disconnected from the board by the twisting
action.
b. Take care not to break the copper foil on the
printed board
3. Installing the leadless component
a. Presolder the contact points of the circuit board.
b. Press the part downward with tweezers and solder
both electrodes as shown below.
Note: Do not glue the replacement leadless
component to the circuit board.
Chip
Soldering Iron
Tweezers
Presolder
1-3-2
Tweezers
Soldering Iron
Solder
Soldering Iron
TVVCRP_SN