Table Of Contents - Sony MZ-S1 Service Manual
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Also See for MZ-S1:
- Operating instructions manual (108 pages) ,
- Specifications (2 pages) ,
- Quick reference manual (2 pages)
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CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
On power sources
• Use house current, LR6 (size AA) battery.
• For use in your house: Use the AC power
adaptor supplied with this recorder. Do not
use any other AC power adaptor since it may
cause the recorder to malfunction.
Polarity of the
plug
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1.
2.
................................................................... 6
3.
3-1. Disassembly Flow ........................................................... 7
3-2. Case (Lower) Section ...................................................... 8
3-3. Buckle (Upper) Assy, Battery Case Lid ......................... 9
3-4. Case (Upper) Section ...................................................... 10
3-5. Mechanism Deck (MT-MZN707-177) ........................... 10
3-6. Set Chassis Assy ............................................................. 11
3-7. MAIN Board ................................................................... 11
3-8. OP Service Assy (LCX-5R) ............................................ 12
3-9. Holder Assy ..................................................................... 13
3-10. DC Motor (Sled) (M602) ................................................ 13
DC Motor (Over Write Head Up/Down) (M603) .......... 14
3-12. Ornament (R), Switch Unit ............................................. 14
4.
.............................................................. 15
5.
6.
6-1. Block Diagram - SERVO/USB Section - ...................... 32
6-2. Block Diagram - AUDIO Section - ............................... 33
POWER SUPPLY Section - ........................................... 34
Schematic Diagrams ....................................................... 35
6-5. Printed Wiring Board
- MAIN Board (Component Side) - ............................. 36
- MAIN Board (Conductor Side) - ............................... 37
6-7. Schematic Diagram - MAIN Board (1/4) - .................. 38
6-8. Schematic Diagram - MAIN Board (2/4) - .................. 39
6-9. Schematic Diagram - MAIN Board (3/4) - .................. 40
6-10. Schematic Diagram - MAIN Board (4/4) - .................. 41
6-11. IC Pin Function Description ........................................... 48
7.
7-1. Case (Upper) Section ...................................................... 55
7-2. Chassis Section ............................................................... 56
7-3. MAIN Board Section ...................................................... 57
7-4. Case (Lower) Section-1 .................................................. 58
7-5. Case (Lower) Section-2 .................................................. 59
7-6. Mechanism Deck Section-1 (MT-MZN707-177) ........... 60
7-7. Mechanism Deck Section-2 (MT-MZN707-177) ........... 61
8.
MZ-S1
............................................... 4
......................... 20
............................... 62
3
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